SCHEMBL23909534

SCHEMBL23909534

Cc1ccc2c(C(=O)Cl)cccc2c1C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.41
KDM4E B2RXH2 2/20 0.41
HPGD P15428 2/20 0.41
HSD17B10 Q99714 2/20 0.41
TDP1 Q9NUW8 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2C9 P11712 1/20 0.39
KMT2A Q03164 1/20 0.39
MCL1 Q07820 2/20 0.38
PRNP P04156 1/20 0.38
NR4A1 P22736 1/20 0.38
NR4A2 P43354 1/20 0.38
NR4A3 Q92570 1/20 0.38
MYC P01106 2/20 0.38
CDC25B P30305 2/20 0.38
PDE10A Q9Y233 1/20 0.36
FABP4 P15090 1/20 0.35
ALOX15 P16050 1/20 0.35
POLB P06746 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9558286 0.88 NR4A1 (0.50) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL23909595 0.83 KMT2A (0.42) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL1048314 0.80 CYP1A2 (0.52) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL10015553 0.80 LDHA (0.47) ALDH1A1TDP1L3MBTL1CYP3A4CYP2C9
SCHEMBL23909590 0.78 TSHR (0.44) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL2153429 0.78 ALDH1A1 (0.52) ALDH1A1KDM4EHPGDHSD17B10L3MBTL1
SCHEMBL3819511 0.76 TDP1 (0.46) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL20659192 0.76 TDP1 (0.41) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL23909552 0.75 HSD17B10 (0.43) ALDH1A1KDM4EHPGDHSD17B10TDP1
SCHEMBL601658 0.74 CYP1A2 (0.54) ALDH1A1CYP3A4KMT2AMCL1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed