SCHEMBL23909565

SCHEMBL23909565

Cc1ccc2cccc(C(N)=O)c2c1C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 6/20 0.47
HSD17B10 Q99714 4/20 0.43
ALDH1A1 P00352 6/20 0.40
KDM4E B2RXH2 3/20 0.40
MYC P01106 1/20 0.40
GAA P10253 1/20 0.40
KMT2A Q03164 3/20 0.40
HPGD P15428 3/20 0.40
MEN1 O00255 2/20 0.40
PDPK1 O15530 1/20 0.39
L3MBTL1 Q9Y468 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
CYP3A4 P08684 2/20 0.38
CYP2C9 P11712 1/20 0.38
TSHR P16473 2/20 0.38
PLK4 O00444 1/20 0.37
CHEK1 O14757 1/20 0.37
AURKA O14965 1/20 0.37
DAPK3 O43293 1/20 0.37
MAP4K4 O95819 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7181510 0.88 HSD17B10 (0.56) HSD17B10ALDH1A1KDM4EMYCKMT2A
SCHEMBL23909552 0.84 HSD17B10 (0.43) HSD17B10ALDH1A1KDM4EMYCKMT2A
SCHEMBL6029391 0.79 ALDH1A1 (0.52) PARP1HSD17B10ALDH1A1KDM4EMYC
SCHEMBL23909554 0.79 PARP1 (0.49) PARP1HSD17B10ALDH1A1KDM4EMYC
SCHEMBL7144245 0.78 TDP1 (0.46) HSD17B10ALDH1A1KDM4EKMT2AHPGD
SCHEMBL29093194 0.78 HSD17B10 (0.49) PARP1HSD17B10ALDH1A1KDM4EMYC
SCHEMBL28163000 0.77 HSD17B10 (0.64) PARP1HSD17B10ALDH1A1KDM4EGAA
SCHEMBL1353024 0.77 HSD17B10 (0.64) PARP1HSD17B10ALDH1A1KDM4EGAA
SCHEMBL157601 0.76 KDM4E (0.55) PARP1HSD17B10ALDH1A1KDM4EGAA
SCHEMBL23909595 0.75 KMT2A (0.42) PARP1HSD17B10ALDH1A1KDM4EMYC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed