SCHEMBL23909601

SCHEMBL23909601

COC(=O)c1cccc2ccc(C(N)=O)cc12

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLAU P00749 4/20 0.54
PTPN1 P18031 1/20 0.48
MTNR1A P48039 1/20 0.47
PLAT P00750 1/20 0.46
MAPT P10636 3/20 0.46
SLC6A2 P23975 1/20 0.46
SLC6A4 P31645 1/20 0.46
SLC6A3 Q01959 1/20 0.46
ALDH1A1 P00352 5/20 0.45
KDM4E B2RXH2 3/20 0.45
GAA P10253 2/20 0.45
PARP1 P09874 1/20 0.45
PLA2G2D Q9UNK4 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
HSD17B10 Q99714 2/20 0.44
HPGD P15428 2/20 0.44
ATM Q13315 2/20 0.44
GLA P06280 1/20 0.44
CASP1 P29466 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29576093 0.89 MAPT (0.51) PLAUMTNR1AMAPTSLC6A2SLC6A4
SCHEMBL68296 0.89 MAPT (0.51) PLAUMTNR1AMAPTSLC6A2SLC6A4
SCHEMBL23909555 0.88 PLAU (0.54) PLAUPTPN1MTNR1APLATMAPT
SCHEMBL23909566 0.88 PTPN1 (0.51) PLAUPTPN1PLATMAPTSLC6A2
SCHEMBL30362183 0.88 PLAU (0.54) PLAUPTPN1MTNR1APLATMAPT
SCHEMBL28311980 0.86 PLA2G2D (0.60) PLAUPTPN1MTNR1AMAPTSLC6A2
SCHEMBL23909574 0.85 PLAU (0.47) PLAUMTNR1AMAPTSLC6A2SLC6A4
SCHEMBL28124449 0.84 KDM4E (0.62) PLAUPTPN1PLATALDH1A1KDM4E
SCHEMBL26886714 0.84 MTNR1A (0.59) PLAUMTNR1AMAPTSLC6A2SLC6A4
SCHEMBL26887158 0.81 PLAU (0.47) PLAUMTNR1ASLC6A2SLC6A4SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed