SCHEMBL23909600

SCHEMBL23909600

Cc1ccc2ccc(C(N)=O)cc2c1C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.43
PTPN1 P18031 1/20 0.42
PARP1 P09874 1/20 0.41
PLAU P00749 3/20 0.40
ALDH1A1 P00352 3/20 0.38
PRSS1 P07477 1/20 0.38
PRSS2 P07478 1/20 0.38
PRSS3 P35030 1/20 0.38
PLA2G2D Q9UNK4 1/20 0.38
MAPT P10636 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
KMT2A Q03164 1/20 0.36
PARP15 Q460N3 1/20 0.36
PARP10 Q53GL7 1/20 0.36
CHEK2 O96017 1/20 0.36
TSHR P16473 1/20 0.36
KDM4E B2RXH2 1/20 0.36
BRD4 O60885 1/20 0.36
BRPF1 P55201 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909564 0.89 LCK (0.46) LCKPTPN1PARP1PLAUALDH1A1
SCHEMBL23909573 0.83 ALDH1A1 (0.39) PLAUALDH1A1PLA2G2DMAPTTDP1
SCHEMBL21871911 0.80 LCK (0.43) LCKPTPN1PARP1PLAUPRSS1
SCHEMBL7144236 0.79 LDHA (0.50) ALDH1A1MAPTKMT2AKDM4ESMN1; SMN2
SCHEMBL23909543 0.77 PTPN1 (0.48) LCKPTPN1PARP1PLAUALDH1A1
SCHEMBL20669903 0.76 DHODH (0.47) ALDH1A1
SCHEMBL11591905 0.76 PTPN1 (0.50) PTPN1ALDH1A1MAPTTDP1KMT2A
SCHEMBL21940698 0.75 ERN1 (0.47) LCKPTPN1PARP1ALDH1A1PRSS1
SCHEMBL21940612 0.75 LCK (0.42) LCKPARP1PLAUALDH1A1PRSS1
SCHEMBL10261196 0.73 ALDH1A1 (0.47) LCKPARP1ALDH1A1MAPTTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed