SCHEMBL23909570

SCHEMBL23909570

N#Cc1cccc2cccc(S(=O)(=O)Cl)c12

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.42
ALDH1A1 P00352 1/20 0.42
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
SLC40A1 Q9NP59 1/20 0.40
SLC22A12 Q96S37 5/20 0.40
TRPV4 Q9HBA0 1/20 0.35
MAPT P10636 1/20 0.35
MAPK1 P28482 1/20 0.35
POLB P06746 1/20 0.35
KAT6A Q92794 1/20 0.35
FBP1 P09467 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909578 0.84 CA2 (0.48) HTTALDH1A1CA1CA2SLC40A1
SCHEMBL7808965 0.82 HTT (0.41) HTTALDH1A1CA1CA2SLC40A1
SCHEMBL7813445 0.82 TTR (0.47) HTTALDH1A1CA1CA2SLC40A1
SCHEMBL29948777 0.79 ALDH1A1 (0.58) HTTALDH1A1SLC40A1SLC22A12TRPV4
SCHEMBL489976 0.79 ALDH1A1 (0.58) HTTALDH1A1SLC40A1SLC22A12TRPV4
SCHEMBL7761256 0.78 ALDH1A1 (0.44) HTTALDH1A1CA1CA2SLC40A1
Hydrochloric Acid SCHEMBL3938103 0.77 ALDH1A1 (0.56) HTTALDH1A1SLC40A1SLC22A12TRPV4
SCHEMBL25170432 0.76 ALDH1A1 (0.43) HTTALDH1A1CA1CA2SLC40A1
SCHEMBL31387937 0.76 ALDH1A1 (0.47) HTTALDH1A1SLC40A1SLC22A12TRPV4
SCHEMBL5242541 0.76 HTT (0.43) HTTALDH1A1CA1CA2SLC40A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed