SCHEMBL23909575

SCHEMBL23909575

O=C(Cl)c1ccc2c([N+](=O)[O-])cccc2c1

nearest known ligand 0.54

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.54
TSHR P16473 2/20 0.53
TDP1 Q9NUW8 2/20 0.47
CASP6 P55212 2/20 0.44
APEX1 P27695 1/20 0.42
GPR35 Q9HC97 1/20 0.42
VCAM1 P19320 2/20 0.41
PTPN1 P18031 1/20 0.41
HPRT1 P00492 1/20 0.41
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
HIPK2 Q9H2X6 1/20 0.39
GAA P10253 1/20 0.39
MAPT P10636 1/20 0.39
CYP3A4 P08684 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909538 0.88 ALDH1A1 (0.54) ALDH1A1TSHRTDP1CASP6APEX1
SCHEMBL11052022 0.86 PTPN1 (0.58) ALDH1A1TSHRTDP1CASP6APEX1
SCHEMBL23909599 0.84 ALDH1A1 (0.54) ALDH1A1TSHRTDP1CASP6MEN1
SCHEMBL18640132 0.81 AKR1C4 (0.54) ALDH1A1VCAM1MEN1KMT2AGAA
SCHEMBL10392289 0.77 KMT2A (0.58) ALDH1A1MEN1KMT2AGAAMAPT
SCHEMBL2934866 0.77 ALDH1A1 (0.61) ALDH1A1TSHRTDP1CASP6APEX1
SCHEMBL11696487 0.77 ALDH1A1 (0.61) ALDH1A1TSHRTDP1CASP6VCAM1
SCHEMBL9735773 0.75 ALDH1A1 (0.69) ALDH1A1TSHRTDP1CASP6APEX1
SCHEMBL8668528 0.75 TSHR (0.66) ALDH1A1TSHRTDP1CASP6GPR35
SCHEMBL3917253 0.75 PLAU (0.52) ALDH1A1PTPN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed