SCHEMBL23909599

SCHEMBL23909599

NC(=O)c1ccc2c([N+](=O)[O-])cccc2c1

nearest known ligand 0.54

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.54
PARP1 P09874 2/20 0.54
TSHR P16473 3/20 0.53
MAPT P10636 5/20 0.49
TDP1 Q9NUW8 3/20 0.49
KMT2A Q03164 2/20 0.49
KDM4E B2RXH2 1/20 0.49
MEN1 O00255 1/20 0.49
LMNA P02545 5/20 0.46
GAA P10253 4/20 0.46
PKM P14618 2/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
HTT P42858 1/20 0.44
ERN1 O75460 1/20 0.44
CASP6 P55212 1/20 0.44
SLC9A1 P19634 1/20 0.43
CRHBP P24387 1/20 0.42
CRHR2 Q13324 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7061043 0.88 ALDH1A1 (0.54) ALDH1A1PARP1TSHRMAPTTDP1
SCHEMBL11052022 0.86 PTPN1 (0.58) ALDH1A1TSHRTDP1KMT2AMEN1
SCHEMBL23909575 0.84 ALDH1A1 (0.54) ALDH1A1TSHRMAPTTDP1KMT2A
SCHEMBL18640132 0.81 AKR1C4 (0.54) ALDH1A1MAPTKMT2AKDM4EMEN1
SCHEMBL10392289 0.77 KMT2A (0.58) ALDH1A1MAPTKMT2AKDM4EMEN1
SCHEMBL2934866 0.77 ALDH1A1 (0.61) ALDH1A1TSHRMAPTTDP1KMT2A
SCHEMBL8686915 0.77 ALDH1A1 (0.61) ALDH1A1TSHRMAPTTDP1KMT2A
Acetamide SCHEMBL14889295 0.76 ALDH1A1 (0.76) ALDH1A1TSHRTDP1KMT2AMEN1
SCHEMBL9735773 0.75 ALDH1A1 (0.69) ALDH1A1TSHRMAPTTDP1KMT2A
SCHEMBL8668528 0.75 TSHR (0.66) ALDH1A1TSHRMAPTTDP1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed