SCHEMBL23909589

SCHEMBL23909589

Cc1c(C(=O)O)ccc2c(S(=O)(=O)Cl)cccc12

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EDNRA P25101 1/20 0.42
ALOX15 P16050 1/20 0.39
FABP4 P15090 4/20 0.39
MCL1 Q07820 3/20 0.38
APEX1 P27695 1/20 0.38
HSD17B10 Q99714 2/20 0.38
FABP3 P05413 1/20 0.38
FABP5 Q01469 1/20 0.38
CYP2C9 P11712 1/20 0.38
TSHR P16473 1/20 0.37
PFKFB3 Q16875 1/20 0.36
NR4A1 P22736 1/20 0.36
NR4A2 P43354 1/20 0.36
NR4A3 Q92570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
MMP1 P03956 1/20 0.36
MMP2 P08253 1/20 0.36
MMP9 P14780 1/20 0.36
MMP8 P22894 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1339684 0.82 NR4A1 (0.50) EDNRAALOX15FABP4MCL1APEX1
SCHEMBL1586444 0.82 ALOX15 (0.49) EDNRAALOX15FABP4HSD17B10CYP2C9
SCHEMBL7199165 0.78 MCL1 (0.46) ALOX15FABP4MCL1HSD17B10FABP3
SCHEMBL23909521 0.78 APEX1 (0.38) EDNRAALOX15FABP4MCL1APEX1
SCHEMBL10015552 0.77 CYP1A2 (0.50) ALOX15HSD17B10TSHRKDM4EALDH1A1
SCHEMBL23909561 0.77 HSD17B10 (0.45) ALOX15HSD17B10TSHRPFKFB3NR4A1
SCHEMBL30218700 0.76 KDM4E (0.50) FABP4MCL1HSD17B10CYP2C9TSHR
SCHEMBL18936303 0.76 KDM4E (0.50) FABP4MCL1HSD17B10CYP2C9TSHR
SCHEMBL23909590 0.76 TSHR (0.44) ALOX15FABP4MCL1HSD17B10CYP2C9
SCHEMBL3133065 0.75 CDK2 (0.46) MCL1APEX1HSD17B10CYP2C9TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed