SCHEMBL23909574

SCHEMBL23909574

COC(=O)c1cccc2ccc(C(=O)Cl)cc12

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLAU P00749 2/20 0.47
MTNR1A P48039 1/20 0.47
SLC6A2 P23975 1/20 0.46
SLC6A4 P31645 1/20 0.46
SLC6A3 Q01959 1/20 0.46
PLA2G2D Q9UNK4 1/20 0.44
MAPT P10636 4/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
KDM4E B2RXH2 5/20 0.42
ALDH1A1 P00352 5/20 0.42
ALOX12 P18054 2/20 0.42
HPGD P15428 2/20 0.42
NPSR1 Q6W5P4 1/20 0.42
MAPK8 P45983 1/20 0.42
MAPK9 P45984 1/20 0.42
MAPK10 P53779 1/20 0.42
NQO2 P16083 1/20 0.42
LMNA P02545 1/20 0.41
TSHR P16473 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL68296 0.89 MAPT (0.51) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL29576093 0.89 MAPT (0.51) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL30362287 0.88 PTPN1 (0.51) SLC6A2SLC6A4SLC6A3MAPTMEN1
SCHEMBL23909525 0.88 PTPN1 (0.51) SLC6A2SLC6A4SLC6A3MAPTMEN1
SCHEMBL23909536 0.88 NQO2 (0.47) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL30362194 0.88 NQO2 (0.47) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL28311980 0.86 PLA2G2D (0.60) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL23909601 0.85 PLAU (0.54) PLAUMTNR1ASLC6A2SLC6A4SLC6A3
SCHEMBL2154707 0.84 PLA2G2D (0.51) PLAUMTNR1APLA2G2DMAPTKDM4E
SCHEMBL26886714 0.84 MTNR1A (0.59) PLAUMTNR1ASLC6A2SLC6A4SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed