SCHEMBL23909602

SCHEMBL23909602

N#Cc1ccc2ccc(S(=O)(=O)Cl)cc2c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPV4 Q9HBA0 2/20 0.45
CA1 P00915 3/20 0.42
CA2 P00918 3/20 0.42
KAT6A Q92794 1/20 0.41
CA12 O43570 1/20 0.41
CA9 Q16790 1/20 0.41
RAD51 Q06609 1/20 0.39
PTPN1 P18031 2/20 0.38
PTPN2 P17706 1/20 0.38
F2 P00734 1/20 0.38
PLG P00747 1/20 0.38
PLAU P00749 1/20 0.38
KLKB1 P03952 1/20 0.38
PRSS1 P07477 1/20 0.38
FLT1 P17948 1/20 0.38
FLT4 P35916 1/20 0.38
KDR P35968 1/20 0.38
VCAM1 P19320 1/20 0.38
BRD1 O95696 2/20 0.37
BRPF1 P55201 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8114178 0.95 TRPV4 (0.46) TRPV4CA1CA2KAT6ACA12
SCHEMBL2263247 0.82 LMNA (0.46) CA1CA2CA9F2PRSS1
SCHEMBL30615201 0.82 LMNA (0.46) CA1CA2CA9F2PRSS1
SCHEMBL14059125 0.82 CA1 (0.58) CA1CA2KAT6ACA12CA9
SCHEMBL61854 0.78 CA1 (0.55) TRPV4CA1CA2CA12CA9
SCHEMBL1341822 0.78 CYP2A6 (0.52) CA1CA2CA12CA9PTPN1
SCHEMBL29489123 0.78 CYP2A6 (0.52) CA1CA2CA12CA9PTPN1
SCHEMBL23909604 0.76 CA1 (0.59) CA1CA2CA12CA9PTPN1
SCHEMBL11141968 0.76 SNCA (0.47) CA1CA2KAT6ACA12CA9
SCHEMBL30357699 0.76 LMNA (0.48) CA1CA2CA9F2PRSS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed