SCHEMBL23909604

SCHEMBL23909604

N#Cc1ccc2cc(S(N)(=O)=O)ccc2c1

nearest known ligand 0.66

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CA1 P00915 11/20 0.59
CA2 P00918 11/20 0.59
CA9 Q16790 10/20 0.59
CA12 O43570 7/20 0.59
LMNA P02545 1/20 0.58
MAOA P21397 2/20 0.53
MAOB P27338 2/20 0.53
CA13 Q8N1Q1 1/20 0.49
CA4 P22748 2/20 0.46
CA14 Q9ULX7 1/20 0.46
ALDH1A1 P00352 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
PKM P14618 1/20 0.44
P4HB P07237 1/20 0.43
PTPN1 P18031 2/20 0.42
PTPN2 P17706 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14059125 0.95 CA1 (0.58) CA1CA2CA9CA12LMNA
SCHEMBL7345218 0.82 CA1 (0.53) CA1CA2CA9CA12LMNA
SCHEMBL7345212 0.82 CA1 (0.53) CA1CA2CA9CA12LMNA
SCHEMBL9839080 0.82 LMNA (0.82) CA1CA2CA9CA12LMNA
SCHEMBL11141968 0.81 SNCA (0.47) CA1CA2CA9CA12MAOA
SCHEMBL8114178 0.81 TRPV4 (0.46) CA1CA2CA9CA12MAOA
SCHEMBL329973 0.80 CA2 (0.88) CA1CA2CA9CA12MAOA
Ammonia Solution, Strong SCHEMBL27578396 0.78 CA2 (0.84) CA1CA2CA9CA12MAOA
SCHEMBL791765 0.77 CA2 (0.67) CA1CA2CA9CA12CA13
SCHEMBL1344485 0.77 CYP2A6 (0.54) CA1CA2CA9CA12CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed