SCHEMBL23940757

SCHEMBL23940757

CC1=Cc2c(cccc2S(C)(=O)=O)C(=O)C1=N

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
S100A4 P26447 1/20 0.36
ALDH1A1 P00352 4/20 0.33
SMN1; SMN2 Q16637 3/20 0.33
MAPT P10636 3/20 0.33
MEN1 O00255 2/20 0.33
TP53 P04637 2/20 0.33
CYP1A2 P05177 2/20 0.33
CYP3A4 P08684 2/20 0.33
HSPD1 P10809 2/20 0.33
HPGD P15428 2/20 0.33
MAPK1 P28482 2/20 0.33
CDC25A P30304 2/20 0.33
CDC25B P30305 2/20 0.33
BLM P54132 2/20 0.33
HSPE1 P61604 2/20 0.33
KMT2A Q03164 2/20 0.33
TST Q16762 2/20 0.33
LMNA P02545 2/20 0.33
HSD11B1 P28845 1/20 0.33
PLIN1 O60240 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14488751 0.73 BAZ2B (0.36) S100A4ALDH1A1SMN1; SMN2KMT2AHSD11B1
SCHEMBL21087501 0.71 ALDH1A1 (0.38) ALDH1A1SMN1; SMN2MAPTMEN1TP53
SCHEMBL5886356 0.69 PTPRC (0.49) ALDH1A1SMN1; SMN2MAPTMEN1TP53
SCHEMBL20026453 0.69
SCHEMBL819288 0.67 BAZ2B (0.33) ALDH1A1SMN1; SMN2KMT2AHSD11B1KDM4E
SCHEMBL8036860 0.64 MEN1 (0.30) ALDH1A1SMN1; SMN2MAPTMEN1TP53
SCHEMBL818753 0.64 BRD9 (0.31) ALDH1A1SMN1; SMN2HSD11B1
SCHEMBL21795322 0.62 HSD11B1 (0.34) ALDH1A1SMN1; SMN2KMT2AHSD11B1KDM4E
SCHEMBL23815139 0.62 ALDH1A1 (0.32) ALDH1A1SMN1; SMN2HSD11B1MAOBKDM4E
SCHEMBL13930824 0.62 ALDH1A1 (0.32) ALDH1A1SMN1; SMN2HSD11B1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed