Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 1/20 | 0.34 |
| ▸ | RAB9A | P51151 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | CTSG | P08311 | 2/20 | 0.33 |
| ▸ | KLK7 | P49862 | 2/20 | 0.33 |
| ▸ | KLK14 | Q9P0G3 | 2/20 | 0.33 |
| ▸ | KLK5 | Q9Y337 | 2/20 | 0.33 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | CTRC | Q99895 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | ALOX5AP | P20292 | 1/20 | 0.31 |
| ▸ | FEN1 | P39748 | 1/20 | 0.31 |
| ▸ | BRD9 | Q9H8M2 | 1/20 | 0.30 |
| ▸ | BAZ2B | Q9UIF8 | 1/20 | 0.30 |
| ▸ | BAZ2A | Q9UIF9 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14488751 | 0.68 | BAZ2B (0.36) | HSD11B1RAB9AALDH1A1KDM4EGRM2 | |
| SCHEMBL23815139 | 0.63 | ALDH1A1 (0.32) | HSD11B1RAB9AALDH1A1CTSGKLK7 | |
| SCHEMBL21087501 | 0.62 | ALDH1A1 (0.38) | HSD11B1RAB9AALDH1A1CTSGKDM4E | |
| SCHEMBL23940757 | 0.62 | S100A4 (0.36) | HSD11B1ALDH1A1KDM4EKMT2ASMN1; SMN2 | |
| SCHEMBL8106699 | 0.61 | LOX (0.47) | HSD11B1RAB9AALDH1A1KDM4ESMN1; SMN2 | |
| SCHEMBL1831245 | 0.61 | ALOX15 (0.43) | HSD11B1RAB9AALDH1A1CTSGKLK7 | |
| SCHEMBL20026453 | 0.60 | — | — | |
| SCHEMBL7719846 | 0.60 | BCAT2 (0.38) | HSD11B1SMN1; SMN2L3MBTL1 | |
| SCHEMBL13165739 | 0.60 | CDK2 (0.46) | PRSS1KMT2ASMN1; SMN2L3MBTL1 | |
| SCHEMBL1970261 | 0.60 | HSD11B1 (0.40) | HSD11B1RAB9AALDH1A1CTSGKLK7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 177 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4066059-B1 | CHEMICALLY AMPLIFIED PHOTORESIST | MERCK PATENT GMBH (DE) | 2024-02-28 | — | — | EP | disclosed |
| US-11822242-B2 | DNQ-type photoresist composition including alkali-soluble acrylic resins | MERCK PATENT GMBH (DE) | 2023-11-21 | — | — | US | disclosed |
| US-11822243-B2 | Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2023-11-21 | — | — | US | disclosed |
| US-20230369271-A1 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-11-16 | — | — | US | disclosed |
| WO-2023190218-A1 | DISPLAY DEVICE AND PHOTOSENSITIVE COMPOSITION | 東レ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023190317-A1 | DISPLAY DEVICE | 東レ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| EP-4063954-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| WO-2023181812-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISPLAY DEVICE PROVIDED WITH SAME | 東レ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023182327-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED PRODUCT | 東レ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-20170139323-A1 | Resin Composition Including Novel Polymer and Organic Film Using the Same | SAMSUNG SDI CO., LTD. (KR) | 2017-05-18 | — | — | US | disclosed |
| US-9633755-B2 | Conductive composition, conductive member, conductive member production method, touch panel, and solar cell | FUJIFILM CORPORATION (JP) | 2017-04-25 | — | — | US | disclosed |
| US-20170088672-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2017-03-30 | — | — | US | disclosed |
| WO-2017038664-A1 | COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2017-03-09 | — | — | WO | disclosed |
| US-9578732-B2 | Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel | FUJIFILM CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| US-9562124-B2 | Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof | PROMERUS, LLC (US) | 2017-02-07 | — | — | US | disclosed |
| US-9557645-B2 | Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-01-31 | — | — | US | disclosed |
| US-20150118622-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device | CHEIL INDUSTRIES INC. (KR) | 2015-04-30 | — | — | US | disclosed |
| US-7229739-B2 | Infrared sensitive mixture of a hydroxy substituted polymer such as a novolak or resole and a diphenylcarbinol solubility suppressor, e.g.,4,4'-bis(dimethylamino)benzhydrol, benzhydrol or 4,4'-dimethoxybenzhydrol; may also contain an infrared radiation absorbing compound. | ANOCOIL CORPORATION (US) | 2007-06-12 | — | — | US | disclosed |