SCHEMBL23940761

SCHEMBL23940761

BC(C)(OCCC)C(=O)C(C)C

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.32
CYP1A2 P05177 1/20 0.32
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23784486 0.83 MMP8 (0.31) CYP1A2
SCHEMBL27410073 0.79 CYP1A2 (0.33) LMNACYP1A2HSD17B10
SCHEMBL24702528 0.76 CYP1A2 (0.32) CYP1A2HSD17B10
SCHEMBL27416269 0.66 MMP8 (0.32) CYP1A2
SCHEMBL24450216 0.65 NAAA (0.41) LMNA
SCHEMBL17878615 0.65 MEN1 (0.34)
SCHEMBL28908287 0.64 CTSK (0.32) HSD17B10
SCHEMBL22624840 0.64
SCHEMBL15912641 0.63 HSD17B10 (0.31) HSD17B10
SCHEMBL22609458 0.63 LMNA (0.38) LMNAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed