SCHEMBL23966408

SCHEMBL23966408

Cc1ccc(Oc2ccc(NC(=O)C(C)(C)CC(=O)O)cc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FNTA P49354 2/20 0.50
FNTB P49356 2/20 0.50
PDK1 Q15118 1/20 0.50
PDK2 Q15119 1/20 0.50
PDK3 Q15120 1/20 0.50
PDK4 Q16654 1/20 0.50
PNLIP P16233 1/20 0.47
HPGD P15428 3/20 0.47
NPC1 O15118 2/20 0.47
RAB9A P51151 2/20 0.47
CRHBP P24387 1/20 0.47
CRHR2 Q13324 1/20 0.47
MAPK14 Q16539 1/20 0.46
LTA4H P09960 1/20 0.46
ALDH1A1 P00352 2/20 0.46
LMNA P02545 1/20 0.46
GAA P10253 1/20 0.46
ALOX15 P16050 1/20 0.46
TSHR P16473 1/20 0.46
MAPK1 P28482 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23966409 0.80 FNTA (0.53) FNTAFNTBPNLIPHPGDNPC1
SCHEMBL9923778 0.77 HDAC1 (0.56) PDK1PDK2PDK3PDK4PNLIP
SCHEMBL13934889 0.75 POLB (0.55) NPC1RAB9ALMNAHTTL3MBTL1
SCHEMBL13923522 0.74 MMP13 (0.49) FNTAFNTBPDK1PDK2PDK3
SCHEMBL12584932 0.73 HTT (0.69) NPC1RAB9AALDH1A1LMNAHTT
SCHEMBL5612841 0.73 TDP1 (0.77) PNLIPHPGDNPC1RAB9AALDH1A1
SCHEMBL23323205 0.73 POLB (0.68) FNTAFNTBPNLIPHPGDNPC1
SCHEMBL23966382 0.73 HPGD (0.53) PNLIPHPGDNPC1RAB9ACRHBP
SCHEMBL25812517 0.72 FNTA (0.51) FNTAFNTBPNLIPHPGDNPC1
SCHEMBL2172248 0.72 MTNR1A (0.64) FNTAFNTBPNLIPHPGDNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220011669-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-01-13 US disclosed
US-11163234-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-11-02 US disclosed