Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APAF1 | O14727 | 1/20 | 0.66 |
| ▸ | POLB | P06746 | 1/20 | 0.66 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.58 |
| ▸ | GAA | P10253 | 6/20 | 0.54 |
| ▸ | MGAM | O43451 | 5/20 | 0.54 |
| ▸ | AMY1A | P0DUB6 | 5/20 | 0.54 |
| ▸ | SI | P14410 | 5/20 | 0.54 |
| ▸ | MGAM2 | Q2M2H8 | 5/20 | 0.54 |
| ▸ | RAB9A | P51151 | 5/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.51 |
| ▸ | SLC9A1 | P19634 | 2/20 | 0.49 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.49 |
| ▸ | NPC1 | O15118 | 3/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.48 |
| ▸ | MAPT | P10636 | 4/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | USP2 | O75604 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29393597 | 1.00 | APAF1 (0.66) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL21304645 | 0.83 | APAF1 (0.75) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL5828539 | 0.79 | APAF1 (0.69) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL3264736 | 0.79 | APAF1 (0.41) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL29625506 | 0.77 | GAA (0.73) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL361654 | 0.77 | GAA (0.73) | APAF1POLBEGLN3GAAMGAM | |
| Hydrochloric Acid SCHEMBL1371916 | 0.75 | GAA (0.71) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL972935 | 0.75 | APAF1 (0.62) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL13731229 | 0.74 | APAF1 (0.66) | APAF1POLBEGLN3GAAMGAM | |
| SCHEMBL6885340 | 0.74 | EGLN3 (1.00) | APAF1POLBEGLN3GAAMGAM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 654 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109743878-B | Suspension and grinding method | 昭和电工材料株式会社 | 2021-07-06 | — | — | CN | claimed |
| CN-112385019-A | Etchant composition | 朗姆研究公司 | 2021-02-19 | — | — | CN | claimed |
| CN-107406752-B | Polishing agent, stock solution for polishing agent, and polishing method | 日立化成株式会社 | 2020-05-08 | — | — | CN | claimed |
| US-10283373-B2 | CMP polishing liquid and polishing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-05-07 | — | — | US | claimed |
| US-9200180-B2 | Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2015-12-01 | — | — | US | claimed |
| EP-1124912-B1 | A CHEMICAL MECHANICAL POLISHING SLURRY SYSTEM HAVING AN ACTIVATOR SOLUTION | FUJIFILM ELECTRONIC MATERIALS (US) | 2010-07-21 | — | — | EP | claimed |
| US-20090261291-A1 | Chemical-Mechanical Planarization Composition Having Benzenesulfonic Acid and Per-Compound Oxidizing Agents, and Associated Method for Use | VERSUM MATERIALS US, LLC | 2009-10-22 | — | — | US | claimed |
| US-20090130849-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. | 2009-05-21 | — | — | US | claimed |
| WO-2009058274-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | claimed |
| US-20070128872-A1 | Polishing composition and polishing method | SHOWA DENKO K.K. (JP) | 2007-06-07 | — | — | US | claimed |
| EP-1124912-A4 | A CHEMICAL MECHANICAL POLISHING SLURRY SYSTEM HAVING AN ACTIVATOR SOLUTION | ARCH SPEC CHEM INC (US) | 2004-09-01 | — | — | EP | claimed |
| US-20040159050-A1 | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | claimed |
| EP-1354017-A2 | READY-TO-USE STABLE CHEMICAL-MECHANICAL POLISHING SLURRIES | Planar Solutions LLC (US) | 2003-10-22 | — | — | EP | claimed |
| US-20030104770-A1 | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers | ARCH SPECIALTY CHEMICALS, INC. | 2003-06-05 | — | — | US | claimed |
| US-20030064671-A1 | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers | ARCH SPECIALTY CHEMICALS, INC. | 2003-04-03 | — | — | US | claimed |
| US-6468913-B1 | ABRASIVE PARTICLES AND AN OXIDIZING AGENT, STABILITY HAVING SHELF LIFE OF AT LEAST 30 DAYS; FUMED SILICA (SIO2) PARTICLES WITH HYDROGEN PEROXIDE (H2O2) | ARCH SPECIALTY CHEMICALS, INC. | 2002-10-22 | — | — | US | claimed |
| US-6447563-B1 | CONSISTING OF ANOXIDIZER, ACIDS, AMINES, CHELATING AGENTS, FLUORINE-CONTAINING COMPOUNDS, CORROSION INHIBITORS, BUFFERING AGENTS, SURFACTANTS, BIOLOGICAL AGENTS; SEMICONDUCTOR MANUFACTURING. | ARCH SPECIALTY CHEMICALS, INC. | 2002-09-10 | — | — | US | claimed |
| WO-2002004573-A2 | READY-TO-USE STABLE CHEMICAL-MECHANICAL POLISHING SLURRIES | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-01-17 | — | — | WO | claimed |
| EP-1124912-A1 | A CHEMICAL MECHANICAL POLISHING SLURRY SYSTEM HAVING AN ACTIVATOR SOLUTION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-08-22 | — | — | EP | claimed |
| WO-2000024842-A1 | A CHEMICAL MECHANICAL POLISHING SLURRY SYSTEM HAVING AN ACTIVATOR SOLUTION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-05-04 | — | — | WO | claimed |