SCHEMBL24245339

SCHEMBL24245339

CC1=C(Cc2ccccc2)CC(O)C(O)=C1

nearest known ligand 0.35

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CALM1 P0DP23 1/20 0.34
BCL2 P10415 1/20 0.34
BCL2L1 Q07817 1/20 0.34
NQO1 P15559 1/20 0.34
KDM4E B2RXH2 1/20 0.33
GLA P06280 1/20 0.33
GAA P10253 1/20 0.33
HSD17B3 P37058 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
ERAP1 Q9NZ08 1/20 0.33
FYN P06241 1/20 0.33
IDH1 O75874 3/20 0.33
CYP1A2 P05177 1/20 0.32
CYP2C9 P11712 1/20 0.32
MAPK1 P28482 1/20 0.32
HIF1A Q16665 1/20 0.32
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2352229 0.64 CALM1 (0.52) CALM1BCL2BCL2L1KDM4ELMNA
SCHEMBL18890767 0.61 CALM1 (0.38) CALM1BCL2BCL2L1IDH1LMNA
SCHEMBL8087900 0.61 TP53 (0.40) CALM1GAAIDH1CYP1A2LMNA
SCHEMBL31321962 0.61 TAAR1 (0.46) CALM1GAALMNA
SCHEMBL9566501 0.61 CALM1 (0.61) CALM1BCL2BCL2L1KDM4EIDH1
SCHEMBL17480820 0.60 CYP1A2 (0.44) CALM1BCL2BCL2L1GLAIDH1
Diphenylmethane SCHEMBL10394702 0.60 CALM1 (0.92) CALM1BCL2BCL2L1IDH1LMNA
Diphenylmethane SCHEMBL7400899 0.59 CALM1 (0.57) CALM1BCL2BCL2L1IDH1LMNA
SCHEMBL16321665 0.59 CALM1 (0.39) CALM1GLALMNA
SCHEMBL22268641 0.59 CALM1 (0.39) CALM1BCL2BCL2L1IDH1HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3951498-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-02-09 EP disclosed