SCHEMBL24254907

SCHEMBL24254907

Cc1cc(F)c(-c2ccccc2)c(-c2ccccc2C)c1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR7 P34969 1/20 0.38
SMN1; SMN2 Q16637 3/20 0.38
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
ALDH1A1 P00352 2/20 0.38
HPGD P15428 2/20 0.38
TSHR P16473 2/20 0.38
ACHE P22303 1/20 0.38
TTR P02766 1/20 0.37
DHODH Q02127 3/20 0.36
LMNA P02545 3/20 0.35
MCOLN3 Q8TDD5 1/20 0.35
ALOX5AP P20292 1/20 0.35
FEN1 P39748 1/20 0.35
KDM4E B2RXH2 2/20 0.34
GAA P10253 2/20 0.34
MCL1 Q07820 1/20 0.34
METAP2 P50579 1/20 0.34
HDAC7 Q8WUI4 1/20 0.34
PSMB5 P28074 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15856388 0.85 METAP2 (0.41) HPGDTSHRTTRDHODHLMNA
SCHEMBL778763 0.81 DHODH (0.46) ALDH1A1HPGDTSHRACHEDHODH
SCHEMBL27642813 0.73 DHODH (0.38) SMN1; SMN2NPC1RAB9ADHODHKDM4E
SCHEMBL28340723 0.73 MCL1 (0.44) HTR7SMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL20684723 0.71 PDE3B (0.50) HTR7SMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL12999231 0.71 ALDH1A1 (0.37) HTR7SMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL3983595 0.71 HTR7 (0.44) HTR7SMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL27781809 0.71 METAP2 (0.47) SMN1; SMN2ALDH1A1HPGDTSHRACHE
SCHEMBL14962989 0.70 MAOB (0.45) SMN1; SMN2NPC1RAB9AHPGDTSHR
SCHEMBL30286418 0.69 RPS6KA3 (0.46) ALDH1A1HPGDTSHRLMNAMETAP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022034907-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2022-02-17 WO disclosed