SCHEMBL2426083

SCHEMBL2426083

CC(C)(C)OC(=O)CC(O)C1CC2C=CC1C2

nearest known ligand 0.35

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.35
KDM4E B2RXH2 1/20 0.34
LMNA P02545 1/20 0.34
HDAC3 O15379 1/20 0.34
HDAC1 Q13547 1/20 0.34
HDAC2 Q92769 1/20 0.34
HDAC8 Q9BY41 1/20 0.34
HDAC6 Q9UBN7 1/20 0.34
EPHX2 P34913 2/20 0.33
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27982287 0.84 EPHX2 (0.34) EPHX2
SCHEMBL15063320 0.81 ALDH1A1 (0.31) EPHX2ALDH1A1
SCHEMBL6250343 0.81 ALDH1A1 (0.31) EPHX2ALDH1A1
SCHEMBL15063319 0.79
SCHEMBL12938373 0.79
SCHEMBL15063337 0.79 KDM4E (0.30) KDM4ELMNA
SCHEMBL32688787 0.79 ALDH1A1 (0.42) CYP2D6KDM4ELMNAHDAC3HDAC1
SCHEMBL32689092 0.79 KDM4E (0.40) KDM4ELMNAEPHX2ALDH1A1
SCHEMBL2070938 0.77 KDM4E (0.41) KDM4ELMNAEPHX2ALDH1A1
SCHEMBL12938381 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250013149-A1 ADDITIVE FOR 193 NM DRY PHOTORESIST AND PREPARATION METHOD FOR AND APPLICATION OF ADDITIVE CHINA ADVANCED LITHOGRAPHIC MATERIAL TECHNOLOGY CO. LTD. (CN) 2025-01-09 US claimed
CN-116088269-A 193nm wet photoresist additive and preparation method and application thereof 上海芯刻微材料技术有限责任公司 2023-05-09 CN claimed
CN-115963691-A Additive for ArF immersion photoresist and photoresist containing additive 上海芯刻微材料技术有限责任公司 2023-04-14 CN claimed
CN-116082609-B 193Nm wet photoresist additive and preparation method and application thereof 上海芯刻微材料技术有限责任公司 2025-05-30 CN disclosed
CN-116144016-B 193Nm dry photoresist additive and preparation method and application thereof 上海新阳半导体材料股份有限公司 2025-02-14 CN disclosed
CN-116144014-B 193Nm dry photoresist additive and preparation method and application thereof 上海新阳半导体材料股份有限公司 2025-02-14 CN disclosed
US-20250013149-A1 ADDITIVE FOR 193 NM DRY PHOTORESIST AND PREPARATION METHOD FOR AND APPLICATION OF ADDITIVE CHINA ADVANCED LITHOGRAPHIC MATERIAL TECHNOLOGY CO. LTD. (CN) 2025-01-09 US disclosed
CN-116144015-B 193Nm dry photoresist additive and preparation method and application thereof 上海新阳半导体材料股份有限公司 2024-11-19 CN disclosed
US-20240351979-A1 POLYONIUM SALT PHOTOACID GENERATOR FOR ARF LIGHT SOURCE DRY LITHOGRAPHY, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) 2024-10-24 US disclosed
CN-115960341-B ArF immersion type additive for photoresist and photoresist containing ArF immersion type additive 上海芯刻微材料技术有限责任公司 2024-09-06 CN disclosed
WO-2023092817-A1 ADDITIVE FOR 193 NM DRY PHOTORESIST AND PREPARATION METHOD FOR AND APPLICATION OF ADDITIVE 上海新阳半导体材料股份有限公司 2023-06-01 WO disclosed
US-6369143-B1 COPOLYMER OF MALEIC ANHYDRIDE AND CARBOXYLIC ACID-GRAFTED NORBORNENE DERIVATIVES, PHOTOACID GENERATOR, AND SOLVENT; DRY ETCH RESISTANCE, BONDING STRENGTH, TRANSPARENCY KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2002-04-09 US disclosed
US-6358666-B1 PHOTORESISTS, ACID GENERATORS AND STYRENE POLYMERS KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2002-03-19 US disclosed
US-20010041302-A1 Chemically amplified resist composition containing low molecular weight additives SK MATERIALS PERFORMANCE CO., LTD. (KR) 2001-11-15 US disclosed
EP-1126320-A2 Chemically amplified resist composition containing low molecular weight additives Korea Kumho Petrochemical Co. Ltd. (KR) 2001-08-22 EP disclosed
EP-1111466-A1 The chemical amplified resist composition containing norbornane type low molecular additive Korea Kumho Petrochemical Co. Ltd. (KR) 2001-06-27 EP disclosed
US-6146810-A REGULATING THE CONTENT AND KIND OF THE NORBORNENE DERIVATIVES IN THE MATRIX POLYMERS IN ADDITION TO BEING SUPERIOR IN ADHERENCE TO SUBSTRATE AND DRY ETCH RESISTANCE KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2000-11-14 US disclosed
US-6063542-A Polymer for positive photoresist and chemical amplification positive photoresist composition comprising the same KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2000-05-16 US disclosed
EP-0994392-A2 Polymer for radiation-sensitive resist and resist composition containing the same Korea Kumho Petrochemical Co. Ltd. (KR) 2000-04-19 EP disclosed
EP-0989462-A1 Resist polymer and chemical amplified resist composition containing the same Korea Kumho Petrochemical Co. Ltd. (KR) 2000-03-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240351979-A1 POLYONIUM SALT PHOTOACID GENERATOR FOR ARF LIGHT SOURCE DRY LITHOGRAPHY, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF ARF5, ARF1, ARFGEF1 CYP2D6 3954/4885KDM4E 4703/4885LMNA 2206/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.