Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | THRB | P10828 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15392061 | 0.92 | CA2 (0.35) | CA2 | |
| SCHEMBL31345515 | 0.89 | CYP3A4 (0.47) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL11995932 | 0.84 | MEN1 (0.42) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL16598028 | 0.84 | MEN1 (0.42) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL11995937 | 0.84 | MEN1 (0.42) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL313596 | 0.84 | — | — | |
| SCHEMBL12754636 | 0.81 | MEN1 (0.46) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL9576501 | 0.81 | ALDH1A1 (0.40) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL10814868 | 0.81 | ALDH1A1 (0.40) | MEN1THRBHTTKMT2AMAPT | |
| SCHEMBL20314607 | 0.81 | ALDH1A1 (0.40) | MEN1THRBHTTKMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0942028-B1 | Epoxy resin composition | AJINOMOTO KK (JP) | 2004-11-24 | — | — | EP | claimed |
| US-12630668-B2 | Liquid compression molding material | NAMICS CORPORATION (JP) | 2026-05-19 | — | — | US | disclosed |
| EP-4372030-B1 | CURABLE RESIN COMPOSITION | NAMICS CORP (JP) | 2026-03-25 | — | — | EP | disclosed |
| EP-4692055-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20260008904-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-01-08 | — | — | US | disclosed |
| US-12473458-B2 | Sealing method | NITTO DENKO CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| EP-4609432-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4608891-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| US-12384874-B2 | Curing catalyst, resin composition, sealing material, adhesive and cured product | NAMICS CORPORATION (JP) | 2025-08-12 | — | — | US | disclosed |
| EP-3816257-B1 | SEALANT SHEET | NITTO DENKO CORP (JP) | 2025-04-16 | — | — | EP | disclosed |
| US-20160200860-A1 | ONE-COMPONENT CURABLE RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-9018321-B2 | Resin composition | AJINOMOTO CO., INC. (JP) | 2015-04-28 | — | — | US | disclosed |
| EP-2792694-A1 | CURABLE RESIN COMPOSITION | Three Bond Fine Chemical Co., Ltd. (JP) | 2014-10-22 | — | — | EP | disclosed |
| EP-1707585-B1 | ONE-COMPONENT EPOXY RESIN COMPOSITION | AJINOMOTO KK (JP) | 2011-09-28 | — | — | EP | disclosed |
| US-20090030158-A1 | RESIN COMPOSITION | AJINOMOTO CO., INC (JP) | 2009-01-29 | — | — | US | disclosed |
| US-7479534-B2 | One-component epoxy resin composition | AJINOMOTO CO., INC. (JP) | 2009-01-20 | — | — | US | disclosed |
| US-20070021582-A1 | Mixing epoxy resin having 2 or more epoxy groups, a polythiol, a compound that releases a basic component under a curing temperature condition and dissolves in polythiol such as an amineimide, a urea, or an isocyanate; and a Lewis acid; heating, curing; storage stability | AJINOMOTO CO., INC. (JP) | 2007-01-25 | — | — | US | disclosed |
| EP-0942028-B1 | Epoxy resin composition | AJINOMOTO KK (JP) | 2004-11-24 | — | — | EP | disclosed |
| EP-1291390-A1 | CONDUCTIVE RESIN COMPOSITION | Ajinomoto Co., Inc. (JP) | 2003-03-12 | — | — | EP | disclosed |
| EP-0942028-A1 | Epoxy resin composition | Ajinomoto Co., Inc. (JP) | 1999-09-15 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090030158-A1 | RESIN COMPOSITION | PPA1, PTGER1, TAF5 | MEN1 3932/4885THRB 1348/4885HTT 3014/4885 |
| US-12630668-B2 | Liquid compression molding material | PIEZO1, TSNAX, TMCO1 | MEN1 1043/4885THRB 1492/4885HTT 1816/4885 |
| US-20260008904-A1 | THIOL COMPOUND | CBR1, PSMA1, KAT2A | MEN1 3717/4885THRB 1318/4885HTT 2892/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.