SCHEMBL2469693

SCHEMBL2469693

CCCOCc1cc(C(c2cc(COCCC)c(O)c(COCCC)c2)(C(F)(F)F)C(F)(F)F)cc(COCCC)c1O

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.40
ESR1 P03372 2/20 0.36
ESR2 Q92731 2/20 0.36
KDM4E B2RXH2 1/20 0.35
NPC1 O15118 1/20 0.35
BRD4 O60885 1/20 0.35
MITF O75030 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
CYP2C19 P33261 1/20 0.31
ALOX15 P16050 1/20 0.31
MAPK1 P28482 1/20 0.31
HTT P42858 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2466676 0.87 ESR1 (0.38) ESR1ESR2CYP2C19ALOX15MAPK1
SCHEMBL15000814 0.81 PTPN1 (0.43) PTPN1ESR1ESR2KDM4ENPC1
SCHEMBL17751463 0.81 ALOX15 (0.49) PTPN1ESR1ESR2KDM4ENPC1
SCHEMBL2463085 0.80 PRKCE (0.43) ESR1ESR2KDM4ECYP2C19ALOX15
SCHEMBL20958233 0.78 ESR1 (0.38) PTPN1ESR1ESR2CYP2C19ALOX15
SCHEMBL12151247 0.77 PTPN1 (0.40) PTPN1ESR1ESR2KDM4ENPC1
SCHEMBL14997931 0.77 PTPN1 (0.40) PTPN1ESR1ESR2KDM4ENPC1
SCHEMBL19484765 0.77 PTPN1 (0.40) PTPN1ESR1ESR2KDM4ENPC1
SCHEMBL20958248 0.77 GABRA1 (0.46) ESR1ESR2L3MBTL1CYP2C19ALOX15
SCHEMBL17751452 0.76 ALOX15 (0.44) PTPN1ESR1ESR2KDM4ENPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8852726-B2 Photosensitive polymer composition, method of producing pattern and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2014-10-07 US disclosed
US-20120263920-A1 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts OOE MASAYUKI (JP) 2012-10-18 US disclosed
US-8231959-B2 Photosensitive polymer composition, method of producing pattern and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2012-07-31 US disclosed
EP-1708026-B1 PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART HITACHI CHEM DUPONT MICROSYS (JP) 2011-10-05 EP disclosed
US-20080220222-A1 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-09-11 US disclosed
EP-1708026-A1 PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART Hitachi Chemical DuPont Microsystems Ltd. (JP) 2006-10-04 EP disclosed