SCHEMBL2467979

SCHEMBL2467979

[c]1cc[c]c(C2CCCCC2)c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3860873 0.98
SCHEMBL5581551 0.79 TDO2 (0.34)
SCHEMBL16242614 0.75 CEL (0.31)
SCHEMBL677783 0.70 CYP11B2 (0.34)
SCHEMBL7838054 0.70 CYP11B2 (0.34)
SCHEMBL2911923 0.70 CYP11B2 (0.34)
SCHEMBL25216 0.70 CYP11B2 (0.34)
SCHEMBL2476796 0.69 DAO (0.31)
SCHEMBL2254634 0.67 CYP11B2 (0.39)
SCHEMBL1778645 0.67 KMO (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4158670-A QUATERNARY AMMONIUM OR PHOSPHONIUM PHASE TRANSFER AGENTS CASSELLA AKTIENGESELLSCHAFT (DE) 1979-06-19 US claimed
CN-118251458-A Curable composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-06-25 CN disclosed
CN-118251457-A Thermosetting resin composition, prepreg and printed wiring board 三菱瓦斯化学株式会社 2024-06-25 CN disclosed
CN-117836369-A Curable composition, prepreg, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-04-05 CN disclosed
CN-117836370-A Curable composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-04-05 CN disclosed
CN-117836359-A Prepreg, metal foil-clad laminate, and printed circuit board 三菱瓦斯化学株式会社 2024-04-05 CN disclosed
US-11947257-B2 Salt, acid generator, resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-04-02 US disclosed
CN-117795016-A Resin composition, resin sheet, prepreg, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-03-29 CN disclosed
CN-117795003-A Curable composition, prepreg, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-03-29 CN disclosed
WO-2023013716-A1 CURABLE COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL–CLAD LAMINATE, AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2023-02-09 WO disclosed
EP-1589086-A1 ADHESIVE SHEET AND LAYERED PRODUCT TEIJIN LIMITED (JP) 2005-10-26 EP disclosed
US-5233013-A Thermotropic liquid-crystalline aromatic coplymers ENICHEM S.P.A. (IT) 1993-08-03 US disclosed
EP-0298684-B1 CROSSLINKING REAGENTS USEFUL IN TREATING HAIR UNILEVER PLC (GB) 1993-04-21 EP disclosed
US-5155204-A Polyesters and polylactones; heat stability ENICHEM S.P.A. (IT) 1992-10-13 US disclosed
EP-0375036-A1 Thermotropic liquid-crystalline aromatic copolymers ENICHEM S.p.A. (IT) 1990-06-27 EP disclosed
EP-0305128-A1 Hair treatment process UNILEVER PLC (GB) 1989-03-01 EP disclosed
EP-0298684-A2 Crosslinking reagents useful in treating hair UNILEVER PLC (GB) 1989-01-11 EP disclosed
US-4793993-A DIIMIDATES AND DISUCCINIMIDYL APPLICATION; PERMANENT WAVES CHESEBROUGH-POND'S INC. (US) 1988-12-27 US disclosed
US-3972851-A Preparation of polyphenylene oxide using a manganese(II) ortho-hydroxyarene-oxime chelate reaction promoter GENERAL ELECTRIC COMPANY (US) 1976-08-03 US disclosed
US-3965069-A Polyphenylene oxide is prepared using a mixture of manganese chelates as a catalyst GENERAL ELECTRIC COMPANY (US) 1976-06-22 US disclosed