SCHEMBL2476473

SCHEMBL2476473

CCC1(C23C=CC(CC2C(=O)O)C3)C2CC3CC(C2)CC1C3

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 8/20 0.36
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL717501 0.83 HSD11B1 (0.33) HSD11B1MEN1KMT2A
SCHEMBL2477129 0.81 HSD11B1 (0.33) HSD11B1MEN1KMT2A
SCHEMBL6864996 0.74
SCHEMBL7201984 0.72 HSD11B1 (0.31) HSD11B1
SCHEMBL4404945 0.71 CYP2D6 (0.32)
SCHEMBL1151137 0.71
SCHEMBL1349275 0.70 HSD11B1 (0.30) HSD11B1
SCHEMBL7201437 0.69 CYP2D6 (0.38) HSD11B1
SCHEMBL29047689 0.69 PKM (0.33) HSD11B1
SCHEMBL2476552 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6720129-B2 PHOTORESIST COMPRISING FLUOROALKYLATED UNITS OF PHTHALIMIDE AND NORBORNENE-BASED ESTERS SUCH AS 2-METHOXYBUTYL-2-ADAMANTANYL 5-NORBORNENE-2-CARBOXYLATE; ETCH RESISTANCE, HEAT RESISTANCE AND ADHESIVENESS HYNIX SEMICONDUCTOR INC (KR) 2004-04-13 US claimed
US-20020164541-A1 Maleimide-photoresist polymers containing fluorine and photoresist compositions comprising the same HYNIX SEMICONDUCTOR, INC. (KR) 2002-11-07 US claimed
US-20130095425-A1 PHOTORESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2013-04-18 US disclosed
EP-1078945-B1 Polymer for use in a photoresist composition SAMSUNG ELECTRONICS CO LTD (KR) 2011-10-12 EP disclosed
US-6642336-B1 Ultraviolet radiation transparent; improved adhesion, contrast and dry etch resistance SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-11-04 US disclosed
US-6596459-B1 Photosensitive polymer having a main chain consisting of only norbornene-type alicyclic units SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-07-22 US disclosed
EP-1078945-A2 Polymer for use in a photoresist composition SAMSUNG ELECTRONICS CO. LTD. (KR) 2001-02-28 EP disclosed