Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA5A | P35218 | 1/20 | 0.32 |
| ▸ | CA9 | Q16790 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
| ▸ | DRD2 | P14416 | 1/20 | 0.30 |
| ▸ | DRD1 | P21728 | 1/20 | 0.30 |
| ▸ | DRD4 | P21917 | 1/20 | 0.30 |
| ▸ | DRD5 | P21918 | 1/20 | 0.30 |
| ▸ | DRD3 | P35462 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2228757 | 0.85 | CA2 (0.34) | CA2CA1CA5ACA9 | |
| SCHEMBL11172344 | 0.84 | CA2 (0.33) | HSD11B1CA2CA1CA5ACA9 | |
| SCHEMBL36178 | 0.77 | CA2 (0.36) | CA2CA1CA5ACA9ALDH1A1 | |
| SCHEMBL1270050 | 0.73 | HSD11B1 (0.39) | HSD11B1CA2CA1CA5ACA9 | |
| SCHEMBL9421937 | 0.72 | ALDH1A1 (0.31) | ALDH1A1DRD2DRD1DRD4DRD5 | |
| SCHEMBL64775 | 0.71 | PPARA (0.32) | — | |
| SCHEMBL10504323 | 0.70 | CA2 (0.32) | CA2CA1CA5ACA9 | |
| SCHEMBL9421930 | 0.70 | CA1 (0.32) | CA2CA1CA5ACA9 | |
| SCHEMBL503265 | 0.70 | PKM (0.34) | HSD11B1CA2CA1CA5ACA9 | |
| SCHEMBL9421902 | 0.70 | CA1 (0.32) | CA2CA1CA5ACA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1653285-B1 | Evaluation method of resist composition using immersion solvent | TOKYO OHKA KOGYO CO LTD (JP) | 2015-05-27 | — | — | EP | disclosed |
| US-8198004-B2 | Resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| EP-1653284-B1 | Evaluation method of resist composition based on sensitivity | TOKYO OHKA KOGYO CO LTD (JP) | 2011-11-02 | — | — | EP | disclosed |
| EP-1589375-B1 | RESIST COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2011-10-19 | — | — | EP | disclosed |
| US-7541138-B2 | Resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-06-02 | — | — | US | disclosed |
| US-20090130605-A1 | RESIST COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-05-21 | — | — | US | disclosed |
| US-7527909-B2 | Evaluation of suitability of a resist composition as a positive or negative resist composition used in a resist pattern formation method involving an immersion exposure step, which is resistant to the deleterious effects of the solvent used; excellent sensitivity and resist pattern profile | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-05-05 | — | — | US | disclosed |
| US-7501220-B2 | Resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-03-10 | — | — | US | disclosed |
| US-7371510-B2 | Material for forming resist protecting film for use in liquid immersion lithography process, composite film, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-05-13 | — | — | US | disclosed |
| US-7264918-B2 | Resist composition for liquid immersion exposure process and method of forming resist pattern therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-09-04 | — | — | US | disclosed |
| US-20070178394-A1 | Evaluation of suitability of a resist composition as a positive or negative resist composition used in a resist pattern formation method involving an immersion exposure step, which is resistant to the deleterious effects of the solvent used; excellent sensitivity and resist pattern profile | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20070134593-A1 | Material for forming resist protecting film for use in liquid immersion lithography process, composite film, and method for forming resist pattern | HIRAYAMA TAKU | 2007-06-14 | — | — | US | disclosed |
| US-20060154170-A1 | Resist composition for liquid immersion exposure process and method of forming resist pattern therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-07-13 | — | — | US | disclosed |
| US-20060141400-A1 | Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1653285-A2 | Evaluation method of resist composition using immersion solvent | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| EP-1653284-A2 | Evaluation method of resist composition based on sensitivity | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| EP-1610178-A1 | RESIST COMPOSITION FOR LIQUID IMMERSION EXPOSURE PROCESS AND METHOD OF FORMING RESIST PATTERN THEREWITH | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-12-28 | — | — | EP | disclosed |
| EP-1596251-A1 | IMMERSION EXPOSURE PROCESS-USE RESIST PROTECTION FILM FORMING MATERIAL, COMPOSITE FILM, AND RESIST PATTERN FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-11-16 | — | — | EP | disclosed |
| EP-1589375-A1 | RESIST COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-26 | — | — | EP | disclosed |
| US-20050014090-A1 | immersion lithography; sensitivity; using mixture of (meth0acrylate ester and acid generator | TOKYO OHKA KOGYO CO., LTD. | 2005-01-20 | — | — | US | disclosed |