Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL2512355

N.O=S(=O)(O)C(F)C(F)F

nearest known ligand 0.35

Full drug profile on Sugi Atlas →

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
CA5A P35218 1/20 0.31
CA5B Q9Y2D0 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL428998 0.97
Hydrochloric Acid SCHEMBL27621096 0.93 TSHR (0.35) TSHRTDP1CA5ACA5B
SCHEMBL575728 0.85 TSHR (0.30) TSHRTDP1
1,4-Butanediol SCHEMBL575955 0.83
1,3-Propanediol SCHEMBL575361 0.83
SCHEMBL20490048 0.82 TSHR (0.43) TSHRTDP1CA5ACA5B
Ammonia Solution, Strong SCHEMBL19811145 0.79 TSHR (0.30) TSHRTDP1
Propylene Glycol SCHEMBL575797 0.77 TDP1 (0.46) TDP1
Ammonia Solution, Strong SCHEMBL19811018 0.77
Ammonia Solution, Strong SCHEMBL19812295 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12631962-B2 Resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2026-05-19 US disclosed
WO-2024176973-A1 METHOD FOR PRODUCING PURIFIED RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND PURIFIED RESIST COMPOSITION 東京応化工業株式会社 2024-08-29 WO disclosed
US-20230408917-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2023-12-21 US disclosed
US-20220171286-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2022-06-02 US disclosed
US-20200041898-A1 RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN-FORMING METHOD JSR CORPORATION (JP) 2020-02-06 US disclosed
US-10209619-B2 Composition and method of forming pattern using composition JSR CORPORATION (JP) 2019-02-19 US disclosed
US-10090163-B2 Inorganic film-forming composition for multilayer resist processes, and pattern-forming method JSR CORPORATION (JP) 2018-10-02 US disclosed
US-20160349616-A1 SEMICONDUCTOR DEVICE PRODUCTION COMPOSITION AND PATTERN FORMATION METHOD JSR CORPORATION (JP) 2016-12-01 US disclosed
US-9487868-B2 Pattern-forming method JSR CORPORATION (JP) 2016-11-08 US disclosed
US-20150364332-A1 INORGANIC FILM-FORMING COMPOSITION FOR MULTILAYER RESIST PROCESSES, AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2015-12-17 US disclosed
US-8034545-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2011-10-11 US disclosed
US-20090220897-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL CO., LTD. (JP) 2009-09-03 US disclosed
US-20080260956-A1 Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part HITACHI CHEMICAL CO., LTD. (JP) 2008-10-23 US disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
US-7297464-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2007-11-20 US disclosed
EP-1829945-A1 FILM, SILICA FILM AND METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING SILICA FILM, AND ELECTRONIC PART Hitachi Chemical Co., Ltd. (JP) 2007-09-05 EP disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12631962-B2 Resist composition and method for forming resist pattern TERB1, TERF2, LSM8 TSHR 2234/4885TDP1 2306/4885CA5A 1947/4885
US-10090163-B2 Inorganic film-forming composition for multilayer resist processes, and pattern-forming method HCAR1, HSD17B7, BMPR1A TSHR 1437/4885TDP1 3160/4885CA5A 1345/4885
US-20150364332-A1 INORGANIC FILM-FORMING COMPOSITION FOR MULTILAYER RESIST PROCESSES, AND PATTERN-FORMING METHOD HCAR1, HSD17B7, BMPR1A TSHR 1437/4885TDP1 3160/4885CA5A 1345/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.