Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DAO | P14920 | 1/20 | 0.35 |
| ▸ | GABRA1 | P14867 | 2/20 | 0.34 |
| ▸ | GABRB2 | P47870 | 2/20 | 0.34 |
| ▸ | GRM5 | P41594 | 1/20 | 0.33 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.32 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.32 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.31 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.31 |
| ▸ | IAPP | P10997 | 1/20 | 0.31 |
| ▸ | ESR1 | P03372 | 1/20 | 0.31 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.31 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | ELANE | P08246 | 1/20 | 0.30 |
| ▸ | CTSG | P08311 | 1/20 | 0.30 |
| ▸ | HTR1A | P08908 | 1/20 | 0.30 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.30 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.30 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2524117 | 0.89 | CYP3A4 (0.41) | ALOX5PTGS2IAPPLIPGELANE | |
| SCHEMBL2522784 | 0.84 | GABRA1 (0.46) | DAOGABRA1GABRB2PDCD1CD274 | |
| SCHEMBL1918471 | 0.82 | HTR1A (0.40) | DAOGABRA1GABRB2LIPGHTR1A | |
| SCHEMBL3482133 | 0.81 | DAO (0.35) | DAOGABRA1GABRB2GRM5ALOX5 | |
| SCHEMBL9839945 | 0.77 | GRM5 (0.40) | DAOGABRA1GABRB2GRM5PDCD1 | |
| SCHEMBL2522528 | 0.76 | GABRA1 (0.52) | GABRA1GABRB2PDCD1CD274ESR1 | |
| SCHEMBL2522716 | 0.76 | GABRA1 (0.42) | DAOGABRA1GABRB2IAPPALDH1A1 | |
| Hydrogen Peroxide SCHEMBL28094650 | 0.75 | ESR1 (0.46) | DAOGABRA1GABRB2GRM5PDCD1 | |
| SCHEMBL29407427 | 0.74 | ESR1 (0.44) | DAOGABRA1GABRB2GRM5ESR1 | |
| SCHEMBL599914 | 0.74 | ESR1 (0.44) | DAOGABRA1GABRB2GRM5ESR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-116710498-A | Polyimide precursor resin composition and method for producing same | 旭化成株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |