Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 4/20 | 0.46 |
| ▸ | GABRB2 | P47870 | 4/20 | 0.46 |
| ▸ | NLRP3 | Q96P20 | 2/20 | 0.37 |
| ▸ | ANPEP | P15144 | 2/20 | 0.33 |
| ▸ | DPP4 | P27487 | 2/20 | 0.33 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.33 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.33 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.33 |
| ▸ | DAO | P14920 | 1/20 | 0.33 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.32 |
| ▸ | CLCN2 | P51788 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2520038 | 0.84 | DAO (0.35) | GABRA1GABRB2PDCD1CD274DAO | |
| SCHEMBL2524117 | 0.81 | CYP3A4 (0.41) | PTGS2 | |
| SCHEMBL6114437 | 0.80 | GABRA1 (0.46) | GABRA1GABRB2CLCN2 | |
| SCHEMBL9745359 | 0.79 | GABRA1 (0.46) | GABRA1GABRB2ANPEPDPP4DAO | |
| SCHEMBL2522528 | 0.79 | GABRA1 (0.52) | GABRA1GABRB2PDCD1CD274 | |
| SCHEMBL599099 | 0.77 | GABRA1 (0.57) | GABRA1GABRB2NLRP3PDCD1CD274 | |
| SCHEMBL2522716 | 0.75 | GABRA1 (0.42) | GABRA1GABRB2DAO | |
| SCHEMBL273305 | 0.75 | GABRA1 (0.42) | GABRA1GABRB2ANPEPDPP4DAO | |
| Ammonia Solution, Strong SCHEMBL9357829 | 0.74 | GABRA1 (0.55) | GABRA1GABRB2NLRP3PDCD1CD274 | |
| Water SCHEMBL28182555 | 0.74 | GABRA1 (0.55) | GABRA1GABRB2NLRP3PDCD1CD274 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-114207038-B | Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-03-22 | — | — | CN | disclosed |
| CN-116710498-A | Polyimide precursor resin composition and method for producing same | 旭化成株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |