⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL175854 | 1.00 | — | — | |
| SCHEMBL6266852 | 0.84 | CA2 (0.33) | — | |
| SCHEMBL313150 | 0.83 | CYP3A4 (0.30) | — | |
| SCHEMBL6310315 | 0.79 | — | — | |
| SCHEMBL756566 | 0.79 | — | — | |
| SCHEMBL8679501 | 0.78 | FAAH (0.38) | — | |
| SCHEMBL6465250 | 0.78 | CA1 (0.36) | — | |
| SCHEMBL756567 | 0.77 | — | — | |
| SCHEMBL2981480 | 0.77 | — | — | |
| SCHEMBL2048296 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 549 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240192601-A1 | PHOTORESIST TOP COATING MATERIAL FOR ETCHING RATE CONTROL | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-06-13 | — | — | US | claimed |
| US-20210294212-A1 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2021-09-23 | — | — | US | claimed |
| EP-1811339-B1 | Pattern forming method | FUJIFILM CORP (JP) | 2021-03-17 | — | — | EP | claimed |
| EP-2756353-B1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORP (JP) | 2019-05-01 | — | — | EP | claimed |
| US-9170489-B2 | Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device | FUJIFILM CORPORATION (JP) | 2015-10-27 | — | — | US | claimed |
| EP-2756353-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM Corporation (JP) | 2014-07-23 | — | — | EP | claimed |
| US-20140193749-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-07-10 | — | — | US | claimed |
| WO-2013039243-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-03-21 | — | — | WO | claimed |
| US-7074544-B2 | Image recording material | FUJI PHOTO FILM CO., LTD. (JP) | 2006-07-11 | — | — | US | claimed |
| US-20050142484-A1 | Image recording material | FUJI PHOTO FILM CO., LTD. | 2005-06-30 | — | — | US | claimed |
| US-12044967-B2 | Actinic-ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| US-20240241444-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2024-07-18 | — | — | US | disclosed |
| US-12038689-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2024-07-16 | — | — | US | disclosed |
| US-12025919-B2 | Method of storing photoresist coated substrates and semiconductor substrate container arrangement | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-07-02 | — | — | US | disclosed |
| US-20240210826-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND | FUJIFILM CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-1515186-A2 | Positive resist composition and pattern formation method using the same | Fuji Photo Film Co., Ltd. (JP) | 2005-03-16 | — | — | EP | disclosed |
| US-20050048402-A1 | Positive resist composition and pattern formation method using the same | FUJI PHOTO FILM CO., LTD. | 2005-03-03 | — | — | US | disclosed |
| US-20040259028-A1 | Positive resist composition and method of forming pattern using the same | FUJI PHOTO FILM CO., LTD. | 2004-12-23 | — | — | US | disclosed |
| EP-1489459-A1 | Positive resist composition and method of forming pattern using the same | Fuji Photo Film Co., Ltd. (JP) | 2004-12-22 | — | — | EP | disclosed |
| US-20040185373-A1 | Photosensitive composition | FUJI PHOTO FILM CO., LTD. | 2004-09-23 | — | — | US | disclosed |