SCHEMBL25375464

SCHEMBL25375464

CCC(CO)(CO)CO.Cc1ccc(F)cc1C1CC(=O)CC(=O)C1

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 4/20 0.38
SLC9A2 Q9UBY0 4/20 0.38
SLC9A3 P48764 2/20 0.38
TP53 P04637 1/20 0.33
RECQL P46063 1/20 0.33
HTR7 P34969 1/20 0.32
LMNA P02545 1/20 0.30
PER2 O15055 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25375883 0.90 OPRL1 (0.39) SLC9A1SLC9A2SLC9A3TP53RECQL
SCHEMBL25375770 0.87 SLC9A1 (0.39) SLC9A1SLC9A2SLC9A3TP53RECQL
SCHEMBL6794592 0.85 SLC9A1 (0.43) SLC9A1SLC9A2SLC9A3TP53RECQL
SCHEMBL25374573 0.85 TP53 (0.33) TP53RECQL
SCHEMBL25377013 0.83 TP53 (0.33) TP53RECQL
SCHEMBL25376749 0.82 TP53 (0.45) TP53RECQL
SCHEMBL25374797 0.80 RIPK1 (0.36)
SCHEMBL25374556 0.80 GRM7 (0.43) TP53RECQLLMNA
SCHEMBL12958096 0.79 SLC9A1 (0.45) SLC9A1SLC9A2SLC9A3HTR7
SCHEMBL25376348 0.78 MAPT (0.38) TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230399510-A1 THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-14 US disclosed
EP-4239010-A1 THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-09-06 EP disclosed
CN-116323753-A Thermoplastic resin and optical lens comprising the same 三菱瓦斯化学株式会社 2023-06-23 CN disclosed
CN-115996931-A Cyclic diol compound, process for producing the compound, and use of the compound 新日本理化株式会社 2023-04-21 CN disclosed