SCHEMBL2538971

SCHEMBL2538971

Cc1cc(Cc2ccccc2-n2nc3ccccc3n2)c(O)c(CN2C(=O)C3=C(CCCC3)C2=O)c1

nearest known ligand 0.40

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 6/20 0.40
RAB9A P51151 6/20 0.40
POLB P06746 2/20 0.39
LMNA P02545 2/20 0.38
KDM4E B2RXH2 4/20 0.34
ALDH1A1 P00352 4/20 0.33
SMN1; SMN2 Q16637 3/20 0.33
AMY1A P0DUB6 1/20 0.33
IDH1 O75874 1/20 0.32
HPGD P15428 3/20 0.31
MAPT P10636 3/20 0.31
TDP1 Q9NUW8 2/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2C9 P11712 1/20 0.31
CYP2C19 P33261 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
TSHR P16473 1/20 0.31
TGM2 P21980 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29403943 1.00 NPC1 (0.40) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL272931 0.89 NPC1 (0.49) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL29353331 0.89 NPC1 (0.49) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL30097874 0.87 NPC1 (0.40) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL28686539 0.86 RAB9A (0.36) NPC1RAB9APOLBLMNAKDM4E
Oxazole SCHEMBL28947548 0.83 NPC1 (0.41) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL4381990 0.82 LMNA (0.40) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL23222483 0.81 LMNA (0.39) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL28950900 0.80 NPC1 (0.39) NPC1RAB9APOLBLMNAKDM4E
SCHEMBL29481350 0.79 PPARG (0.39) NPC1RAB9APOLBLMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
CN-106715597-B Resin composition, method for producing heat-resistant resin film, and display device 东丽株式会社 2022-03-01 CN disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-2267067-B1 Ultraviolet absorber composition and resin composition stabilized with the absorber composition FUJIFILM CORP (JP) 2015-08-12 EP disclosed
US-8044123-B2 Ultraviolet absorber composition and resin composition FUJIFILM CORPORATION (JP) 2011-10-25 US disclosed
EP-2267067-A1 Ultraviolet absorber composition and resin composition stabilized with the absorber composition Fujifilm Corporation (JP) 2010-12-29 EP disclosed
US-20100324181-A1 ULTRAVIOLET ABSORBER COMPOSITION AND RESIN COMPOSITION FUJIFILM CORPORATION (JP) 2010-12-23 US disclosed