SCHEMBL25399987

SCHEMBL25399987

COC([SiH3])(CCCCC#N)OC

nearest known ligand 0.37

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2501154 0.93 TSHR (0.39) TSHR
SCHEMBL2498368 0.84 MEN1 (0.36) TSHR
SCHEMBL25398609 0.79 TSHR (0.39) TSHR
SCHEMBL25397252 0.72 TSHR (0.41) TSHR
SCHEMBL2864686 0.71 TSHR (0.39) TSHR
SCHEMBL8467117 0.70 ALDH1A1 (0.32) TSHR
SCHEMBL12805505 0.70 TSHR (0.40) TSHR
SCHEMBL12806189 0.70 TSHR (0.40) TSHR
SCHEMBL6036710 0.70 TSHR (0.40) TSHR
SCHEMBL29120357 0.70 TSHR (0.40) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO claimed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US claimed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN claimed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US claimed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US claimed
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO disclosed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US disclosed
EP-4423186-A1 CONDENSATION CURABLE COMPOSITION Momentive Performance Materials Inc. (US) 2024-09-04 EP disclosed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN disclosed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US disclosed
WO-2023076316-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-05-04 WO disclosed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US disclosed