SCHEMBL2501154

SCHEMBL2501154

COC([SiH3])(CCCC#N)OC

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
CYP3A4 P08684 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
ALDH1A1 P00352 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25399987 0.93 TSHR (0.37) TSHR
SCHEMBL2498368 0.86 MEN1 (0.36) TSHRCYP3A4MEN1KMT2AALDH1A1
SCHEMBL25397252 0.78 TSHR (0.41) TSHRMEN1KMT2A
SCHEMBL29144805 0.74 TSHR (0.40) TSHRMEN1KMT2AALDH1A1TDP1
SCHEMBL25398609 0.72 TSHR (0.39) TSHRMEN1KMT2A
SCHEMBL3655924 0.70 TSHR (0.32) TSHR
SCHEMBL215815 0.69 TSHR (0.30) TSHRALDH1A1TDP1
SCHEMBL6884121 0.69
SCHEMBL2156393 0.69 SMN1; SMN2 (0.35) TSHRMEN1KMT2AALDH1A1
SCHEMBL57181 0.69 KIF11 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO claimed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US claimed
EP-4423186-A1 CONDENSATION CURABLE COMPOSITION Momentive Performance Materials Inc. (US) 2024-09-04 EP claimed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN claimed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US claimed
WO-2023076316-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-05-04 WO claimed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US claimed
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO disclosed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US disclosed
WO-2025095375-A1 METHOD FOR PREPARING NON-FLUORINE-BASED SILOXANE-POLYMER COMPOSITE BINDER, NON-FLUORINE-BASED SILOXANE-POLYMER COMPOSITE BINDER PREPARED USING SAME, AND ELECTRODE COMPRISING SAME 한국전기연구원 2025-05-08 WO disclosed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN disclosed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US disclosed
WO-2023076316-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-05-04 WO disclosed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US disclosed
US-20110245398-A1 METHOD FOR PRODUCING CONJUGATED DIENE POLYMER COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-10-06 US disclosed