SCHEMBL25526392

SCHEMBL25526392

COB(OC)c1ccc(C)c(OCc2ccccc2)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.47
MAPK1 P28482 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
LIPE Q05469 1/20 0.44
RXRA P19793 1/20 0.42
RXRB P28702 1/20 0.42
RXRG P48443 1/20 0.42
STAT3 P40763 1/20 0.42
HTT P42858 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
FFAR4 Q5NUL3 2/20 0.42
MAOB P27338 1/20 0.41
PIK3CD O00329 1/20 0.40
ABL1 P00519 1/20 0.40
HCK P08631 1/20 0.40
SRC P12931 1/20 0.40
KDR P35968 1/20 0.40
PIK3CA P42336 1/20 0.40
PIK3CB P42338 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20371015 0.83 LIPE (0.57) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL29958132 0.83 LIPE (0.57) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL14228414 0.77 MAPT (0.56) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL14512892 0.76 MAPK1 (0.51) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL25081934 0.76 MAPT (0.64) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL2912541 0.76 MAPT (0.55) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL19286354 0.76 ALOX5 (0.58) MAPTMAPK1TDP1L3MBTL1SMN1; SMN2
SCHEMBL19088582 0.74 MRGPRX4 (0.55) MAPTMAPK1TDP1L3MBTL1LIPE
SCHEMBL22894882 0.74 PTGDR2 (0.58) MAPTMAPK1TDP1L3MBTL1HTT
SCHEMBL15426843 0.74 FFAR4 (0.65) MAPTMAPK1TDP1L3MBTL1LIPE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230151159-A1 COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-05-18 US disclosed