SCHEMBL25528508

SCHEMBL25528508

C#CCOc1ccc(C)cc1C

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.45
L3MBTL1 Q9Y468 4/20 0.44
KMT2A Q03164 2/20 0.44
NPC1 O15118 1/20 0.44
NFKB1 P19838 1/20 0.44
RAB9A P51151 1/20 0.44
NFKB2 Q00653 1/20 0.44
RELA Q04206 1/20 0.44
MAPT P10636 2/20 0.43
HPGD P15428 5/20 0.42
TSHR P16473 2/20 0.42
MAPK1 P28482 1/20 0.42
MEN1 O00255 1/20 0.42
PYCR1 P32322 1/20 0.41
MRGPRX4 Q96LA9 1/20 0.41
LMNA P02545 3/20 0.40
S1PR4 O95977 1/20 0.40
GAA P10253 1/20 0.40
MAOA P21397 1/20 0.40
MAOB P27338 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21356749 0.85 TSHR (0.49) SMN1; SMN2L3MBTL1NPC1RAB9AMAPT
SCHEMBL14384153 0.81 ACHE (0.59) SMN1; SMN2L3MBTL1KMT2ANPC1RAB9A
SCHEMBL3321454 0.81 SMN1; SMN2 (0.50) SMN1; SMN2L3MBTL1KMT2ANPC1NFKB1
SCHEMBL15651509 0.81 HTR2A (0.49) KMT2AMAPTHPGDTSHRMEN1
SCHEMBL5255078 0.81 L3MBTL1 (0.45) SMN1; SMN2L3MBTL1KMT2ANPC1NFKB1
SCHEMBL20005765 0.80 MAOB (0.54) SMN1; SMN2L3MBTL1KMT2ANPC1RAB9A
SCHEMBL31706010 0.79 USP2 (0.42) L3MBTL1KMT2AMAPTHPGDTSHR
SCHEMBL12723248 0.78 PDE4B (0.45) SMN1; SMN2KMT2AMAPTHPGDTSHR
SCHEMBL29952329 0.78 HPGD (0.44) SMN1; SMN2KMT2AMAPTHPGDTSHR
SCHEMBL891407 0.77 SMN1; SMN2 (0.61) SMN1; SMN2L3MBTL1KMT2ANPC1NFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230152695-A1 RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed