Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | THRB | P10828 | 4/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | ATM | Q13315 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | THRA | P10827 | 1/20 | 0.40 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | TYMS | P04818 | 1/20 | 0.38 |
| ▸ | CASP1 | P29466 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10499684 | 0.88 | KDM4E (0.39) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL28134133 | 0.88 | HSD17B10 (0.39) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL28133169 | 0.88 | KDM4E (0.39) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL28954462 | 0.88 | ALDH1A1 (0.39) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL14530180 | 0.86 | ALDH1A1 (0.44) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL1249722 | 0.86 | KDM4E (0.66) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL24810563 | 0.85 | HSD17B10 (0.37) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL13893720 | 0.85 | GABRA1 (0.43) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL1245242 | 0.84 | TSHR (0.42) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E | |
| SCHEMBL28243735 | 0.84 | SMN1; SMN2 (0.42) | L3MBTL1SMN1; SMN2HSD17B10ALDH1A1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111440575-B | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging | 顺德职业技术学院 | 2021-07-27 | — | — | CN | claimed |
| CN-111440575-A | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging | 顺德职业技术学院 | 2020-07-24 | — | — | CN | claimed |
| CN-117700929-A | Underfill material for protecting 5G communication chip | 烟台德邦科技股份有限公司 | 2024-03-15 | — | — | CN | disclosed |
| CN-115477606-B | Method for rapidly converting ester into alkyne | 中国科学院兰州化学物理研究所 | 2024-01-26 | — | — | CN | disclosed |
| US-20230159695-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| US-20230159695-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| CN-115477606-A | Method for quickly converting ester into alkyne | 中国科学院兰州化学物理研究所 | 2022-12-16 | — | — | CN | disclosed |
| CN-111440575-B | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging | 顺德职业技术学院 | 2021-07-27 | — | — | CN | disclosed |
| CN-107849201-B | Block copolymer | 株式会社日本触媒 | 2021-05-14 | — | — | CN | disclosed |
| CN-111440575-A | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging | 顺德职业技术学院 | 2020-07-24 | — | — | CN | disclosed |