SCHEMBL25857368

SCHEMBL25857368

CC(=O)OCCOc1ccc(-c2ccccc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP3 P08254 1/20 0.55
HDAC1 Q13547 8/20 0.54
HDAC2 Q92769 8/20 0.54
HDAC3 O15379 7/20 0.54
HDAC4 P56524 7/20 0.54
HDAC7 Q8WUI4 7/20 0.54
HDAC10 Q969S8 7/20 0.54
HDAC11 Q96DB2 7/20 0.54
HDAC8 Q9BY41 7/20 0.54
HDAC6 Q9UBN7 7/20 0.54
HDAC9 Q9UKV0 7/20 0.54
HDAC5 Q9UQL6 7/20 0.54
MAPT P10636 3/20 0.53
LMNA P02545 2/20 0.53
PKM P14618 1/20 0.51
LSS P48449 1/20 0.51
PTGER4 P35408 1/20 0.51
RAB9A P51151 3/20 0.50
NPC1 O15118 2/20 0.50
TP53 P04637 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9151891 1.00 MMP3 (0.55) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL9118684 0.93 L3MBTL1 (0.50) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL9487294 0.90 HDAC1 (0.63) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL144171 0.89 THRB (0.61) MAPTLMNAPKMRAB9ANPC1
Phosphine SCHEMBL21815751 0.87 THRB (0.59) MAPTLMNAPKMRAB9ANPC1
SCHEMBL10030181 0.87 L3MBTL1 (0.55) MAPTLMNAPKMRAB9ATP53
SCHEMBL14901539 0.85 L3MBTL1 (0.47) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL8668866 0.84 MAPT (0.54) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL17921568 0.84 THRB (0.56) MAPTLMNAPKMRAB9ANPC1
SCHEMBL12760859 0.84 THRB (0.56) MAPTLMNAPKMRAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11710641-B2 Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2023-07-25 US disclosed