SCHEMBL25916447

SCHEMBL25916447

C=Cc1ccc(S(=O)(=O)OC2(c3ccccc3)CCCC2)cc1

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.39
HSD11B1 P28845 3/20 0.38
PSEN1 P49768 1/20 0.37
PSEN2 P49810 1/20 0.37
APH1B Q8WW43 1/20 0.37
NCSTN Q92542 1/20 0.37
APH1A Q96BI3 1/20 0.37
PSENEN Q9NZ42 1/20 0.37
GAA P10253 2/20 0.35
ALDH1A1 P00352 1/20 0.35
TSHR P16473 1/20 0.35
MCOLN3 Q8TDD5 1/20 0.35
AKR1C1 Q04828 1/20 0.32
DRD3 P35462 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5084591 0.75 TDP1 (0.46) TDP1ALDH1A1
SCHEMBL25916012 0.74 HSD11B1 (0.45) HSD11B1PSEN1PSEN2APH1BNCSTN
SCHEMBL778919 0.73 GAA (0.42) HSD11B1PSEN1PSEN2APH1BNCSTN
SCHEMBL24715987 0.72 TAS1R3 (0.38) ALDH1A1TSHRAKR1C1DRD3
SCHEMBL776247 0.72 PSEN1 (0.42) PSEN1PSEN2APH1BNCSTNAPH1A
SCHEMBL24262285 0.71 TAS1R3 (0.38) ALDH1A1TSHRAKR1C1
SCHEMBL778920 0.71 AKR1C1 (0.44) HSD11B1PSEN1PSEN2APH1BNCSTN
SCHEMBL14131947 0.70 TDP1 (0.37) TDP1ALDH1A1TSHR
SCHEMBL7751891 0.69 OPRM1 (0.41) GAAALDH1A1
SCHEMBL776248 0.69 AKR1C1 (0.43) PSEN1PSEN2APH1BNCSTNAPH1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221640-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 US disclosed
US-20230221640-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 US disclosed