SCHEMBL2597833

SCHEMBL2597833

FC(F)(F)c1cccc(-c2ccccc2)c1C(F)(F)F

nearest known ligand 0.51

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 3/20 0.51
SCN9A Q15858 2/20 0.41
ENPP1 P22413 2/20 0.40
KIF11 P52732 1/20 0.40
PDK2 Q15119 1/20 0.40
CNR2 P34972 1/20 0.39
FFAR4 Q5NUL3 1/20 0.39
AR P10275 2/20 0.39
ALDH1A1 P00352 1/20 0.39
HPGD P15428 1/20 0.39
CES1 P23141 1/20 0.38
DPP4 P27487 1/20 0.38
FABP4 P15090 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28223418 0.96 HSD11B1 (0.49) HSD11B1SCN9AENPP1KIF11PDK2
SCHEMBL28231445 0.89 HSD11B1 (0.44) HSD11B1SCN9AENPP1PDK2CNR2
SCHEMBL6067687 0.84 HSD11B1 (0.55) HSD11B1SCN9AKIF11PDK2CNR2
SCHEMBL3534868 0.82 HSD11B1 (0.44) HSD11B1SCN9APDK2CNR2FFAR4
SCHEMBL28676641 0.82 KIF11 (0.44) HSD11B1KIF11PDK2CNR2AR
SCHEMBL163729 0.82 HSD11B1 (0.55) HSD11B1SCN9AKIF11CNR2FFAR4
SCHEMBL2524411 0.81 RXRA (0.50) PDK2FFAR4ALDH1A1HPGD
Water SCHEMBL7091891 0.80 AR (0.55) HSD11B1SCN9AKIF11CNR2FFAR4
Ammonia Solution, Strong SCHEMBL28126322 0.80 HSD11B1 (0.53) HSD11B1SCN9AKIF11CNR2FFAR4
Methane SCHEMBL28022370 0.80 HSD11B1 (0.53) HSD11B1SCN9AKIF11CNR2FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 332 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119041193-A Preparation method of surface modified polyimide fiber 北京化工大学 2024-11-29 CN claimed
CN-118255989-A Precursor solution of polyimide, polyimide film, preparation method and application of polyimide film 中国地质大学(北京) 2024-06-28 CN claimed
CN-115536816-B Thermosetting epoxy resin shape memory polymer and preparation method thereof 中国科学院兰州化学物理研究所 2024-02-20 CN claimed
CN-116179075-B POSS modified polyimide insulating paint, preparation method and application 中国地质大学(北京) 2023-10-13 CN claimed
CN-116179075-A POSS modified polyimide insulating paint, preparation method and application 中国地质大学(北京) 2023-05-30 CN claimed
CN-115536816-A Thermosetting epoxy resin shape memory polymer and preparation method thereof 中国科学院兰州化学物理研究所 2022-12-30 CN claimed
CN-111205645-A Polyimide film with high transparency and high surface hardness and preparation method thereof 无锡创彩光学材料有限公司 2020-05-29 CN claimed
CN-111205644-A High-transparency high-heat-resistance polyimide film and preparation method thereof 无锡创彩光学材料有限公司 2020-05-29 CN claimed
CN-109880519-A A kind of anti-paraffin coating material and preparation method thereof 四川特聚新材料科技有限公司 2019-06-14 CN claimed
CN-105960682-B Heat conductive electronic substrate and its correlation technique E.I.内穆尔杜邦公司 2019-05-28 CN claimed
US-9663617-B2 Fluorine-containing modified bismaleimide resin NAN YA PLASTICS CORPORATION (TW) 2017-05-30 US claimed
CN-106414393-A Diamine compound for liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display element 东进世美肯株式会社 2017-02-15 CN claimed
CN-106189087-A Low dielectric poss type epoxy resin composite material and preparation method thereof 北京化工大学 2016-12-07 CN claimed
US-20160168330-A1 FLUORINE-CONTAINING MODIFIED BISMALEIMIDE RESIN NAN YA PLASTICS CORPORATION (TW) 2016-06-16 US claimed
CN-103779504-A organic light emitting diode packaging structure DONGGUAN WANSHIDA LIQUID CRYSTAL DISPLAY CO LTD 2014-05-07 CN claimed
EP-2027184-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2009-02-25 EP claimed
WO-2007146382-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-12-21 WO claimed
EP-1089129-B1 Positive type photosensitive resin composition, process for producing pattern and electronic parts HITACHI CHEM DUPONT MICROSYS (JP) 2007-06-13 EP claimed
US-6436593-B1 A POLYIMIDE PRECURSOR OR A POLYOXAZOLE PRECURSOR HAVING A GROUP REPRESENTED BY--OR, ACID GENERATION WITH RADIATION HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2002-08-20 US claimed
EP-1089129-A1 Positive type photosensitive resin composition, process for producing pattern and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2001-04-04 EP claimed