SCHEMBL2605530

SCHEMBL2605530

Cc1cc(C(=O)Nc2cc(C(c3ccc(O)c(NC(=O)c4ccc(C(=O)O)c(C)c4)c3)(C(F)(F)F)C(F)(F)F)ccc2O)ccc1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.49
MEN1 O00255 3/20 0.49
MAPT P10636 2/20 0.49
TDP1 Q9NUW8 2/20 0.49
RAB9A P51151 2/20 0.49
LMNA P02545 1/20 0.49
KCNMA1 Q12791 4/20 0.48
ALDH1A1 P00352 1/20 0.45
HTT P42858 1/20 0.45
AKT1 P31749 1/20 0.43
NR1H4 Q96RI1 4/20 0.43
KCNK2 O95069 3/20 0.42
KCNK10 P57789 3/20 0.42
SERPINE1 P05121 1/20 0.42
GAA P10253 1/20 0.42
HDAC1 Q13547 1/20 0.41
HDAC2 Q92769 1/20 0.41
PPARG P37231 2/20 0.41
PPARA Q07869 1/20 0.41
NPC1 O15118 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14113906 0.92 RXFP1 (0.50) KMT2AMEN1MAPTHTTNR1H4
SCHEMBL15611032 0.90 KMT2A (0.46) KMT2AMEN1MAPTTDP1RAB9A
SCHEMBL2605528 0.86 MEN1 (0.52) KMT2AMEN1MAPTTDP1RAB9A
SCHEMBL12510858 0.86 MEN1 (0.51) KMT2AMEN1KCNMA1AKT1GAA
SCHEMBL2605543 0.85 KCNMA1 (0.62) KMT2AMEN1MAPTTDP1RAB9A
SCHEMBL13650245 0.83 KMT2A (0.37) KMT2AMEN1MAPTTDP1RAB9A
SCHEMBL1871490 0.82 HDAC1 (0.60) KMT2AMEN1RAB9AKCNMA1HTT
SCHEMBL2622756 0.82 SORT1 (0.43) KMT2AMEN1KCNMA1AKT1NR1H4
SCHEMBL19846836 0.82 MAPT (0.40) KMT2AMEN1MAPTTDP1RAB9A
SCHEMBL13213671 0.81 KCNMA1 (0.59) KMT2AMEN1MAPTRAB9AKCNMA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
EP-2555053-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-18 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed