SCHEMBL2605528

SCHEMBL2605528

Cc1cc(C(=O)Nc2cc(C(C)(C)c3ccc(O)c(NC(=O)c4ccc(C(=O)O)c(C)c4)c3)ccc2O)ccc1C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.52
MAPT P10636 2/20 0.52
KMT2A Q03164 2/20 0.52
TDP1 Q9NUW8 2/20 0.52
LMNA P02545 1/20 0.52
RAB9A P51151 1/20 0.52
KCNMA1 Q12791 3/20 0.50
ALDH1A1 P00352 1/20 0.48
HTT P42858 1/20 0.48
NR1H4 Q96RI1 8/20 0.47
SERPINE1 P05121 1/20 0.47
PPARG P37231 3/20 0.46
PPARA Q07869 1/20 0.46
ESRRG P62508 1/20 0.44
GAA P10253 1/20 0.44
ESR1 P03372 1/20 0.44
HDAC1 Q13547 2/20 0.44
HDAC2 Q92769 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25452046 0.91 SERPINE1 (0.48) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL19846839 0.88 TDP1 (0.42) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL10001969 0.88 KMT2A (0.52) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL2605534 0.88 KDM4E (0.46) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL2605530 0.86 KMT2A (0.49) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL12510861 0.86 KCNMA1 (0.54) MEN1KMT2AKCNMA1NR1H4SERPINE1
SCHEMBL2605545 0.84 KCNMA1 (0.62) MEN1MAPTKMT2ATDP1RAB9A
SCHEMBL12510753 0.82 KCNMA1 (0.68) MEN1MAPTKMT2ATDP1RAB9A
SCHEMBL2605531 0.81 TDP1 (0.59) MEN1MAPTKMT2ATDP1LMNA
SCHEMBL19846846 0.80 ALDH1A1 (0.44) MEN1MAPTKMT2ATDP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
EP-1365289-B1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES (JP) 2016-04-20 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed