SCHEMBL2605571

SCHEMBL2605571

COCc1cc(C(C)(C)C)cc(C(C)=O)c1O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRKCE Q02156 3/20 0.46
ALDH1A1 P00352 3/20 0.41
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
MYLK Q15746 2/20 0.41
PRKCG P05129 1/20 0.41
MAPT P10636 1/20 0.41
PRKCA P17252 1/20 0.41
APEX1 P27695 1/20 0.41
RECQL P46063 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
CYP2C19 P33261 3/20 0.40
GABRA1 P14867 1/20 0.37
GABRB2 P47870 1/20 0.37
POLB P06746 1/20 0.36
NR5A2 O00482 1/20 0.36
NR5A1 Q13285 1/20 0.36
CYP3A4 P08684 1/20 0.36
HPGD P15428 1/20 0.36
MAPK1 P28482 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14081747 0.89 PRKCE (0.45) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL14028983 0.88 PRKCE (0.44) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL2605568 0.88 PRKCE (0.44) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL2605563 0.86 PRKCE (0.45) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL5523621 0.85 PRKCE (0.42) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL14015321 0.83 PRKCE (0.47) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL2114143 0.83 CYP2C19 (0.55) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL12432071 0.82 PRKCE (0.49) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL14081748 0.82 PRKCE (0.42) PRKCEALDH1A1MEN1KMT2AMYLK
SCHEMBL14081757 0.82 PRKCE (0.43) PRKCEALDH1A1MEN1KMT2AMYLK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8389649-B2 Siloxane-based resin composition TORAY INDUSTRIES, INC. (JP) 2013-03-05 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-7977028-B2 Photosensitive resin composition and adhesion promoter TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-12-16 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7598009-B2 Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device FUJIFILM CORPORATION (JP) 2009-10-06 US disclosed
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20090035693-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-7476476-B2 Photosensitive resin composition, electronic component using the same, and display unit using the same TORAY INDUSTRIES, INC. (JP) 2009-01-13 US disclosed
US-7455948-B2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2008-11-25 US disclosed
US-7432034-B2 Negative resist composition FUJIFILM CORPORATION (JP) 2008-10-07 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-20080075999-A1 Polyelectrolyte Material, Polyelectrolyte Component, Membrane Electrode Composite Body, and Polyelectrolyte Type Fuel Cell TORAY INDUSTRIES, INC. (JP) 2008-03-27 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER PCNA, TERB1, SMC2 PRKCE 3494/4885ALDH1A1 1144/4885MEN1 4387/4885
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION ICAM1, ESD, CAD PRKCE 4198/4885ALDH1A1 599/4885MEN1 4592/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.