Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR | P00374 | 1/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | RAB9A | P51151 | 1/20 | 0.41 |
| ▸ | CA2 | P00918 | 1/20 | 0.40 |
| ▸ | ACHE | P22303 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.39 |
| ▸ | MEN1 | O00255 | 2/20 | 0.39 |
| ▸ | PDE4A | P27815 | 1/20 | 0.39 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.39 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.39 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.39 |
| ▸ | TTR | P02766 | 1/20 | 0.39 |
| ▸ | CYP4F2 | P78329 | 1/20 | 0.38 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | PLAU | P00749 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 2/20 | 0.37 |
| ▸ | FYN | P06241 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7773470 | 0.84 | MAPT (0.52) | DHFRNPC1POLBRAB9ACA2 | |
| SCHEMBL19087103 | 0.78 | CETP (0.55) | CA2KMT2AMEN1MAPTGAA | |
| SCHEMBL13176613 | 0.77 | ESR1 (0.43) | CA2TTRMAPTPLAUGAA | |
| SCHEMBL7629184 | 0.76 | MAPT (0.50) | DHFRNPC1POLBRAB9ACA2 | |
| SCHEMBL12657996 | 0.76 | ACHE (0.56) | POLBACHEKMT2AMEN1MAPT | |
| SCHEMBL3022833 | 0.76 | CRHBP (0.50) | DHFRNPC1POLBRAB9ACA2 | |
| SCHEMBL29997296 | 0.75 | CA2 (0.68) | NPC1POLBRAB9ACA2ACHE | |
| SCHEMBL119395 | 0.75 | CA2 (0.68) | NPC1POLBRAB9ACA2ACHE | |
| SCHEMBL28170408 | 0.75 | CA2 (0.68) | NPC1POLBRAB9ACA2ACHE | |
| SCHEMBL2908419 | 0.75 | MAOA (0.49) | POLBKMT2AMEN1PDE4APDE4B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9217053-B2 | Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2015-12-22 | — | — | US | disclosed |
| US-20150118499-A1 | ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-04-30 | — | — | US | disclosed |
| US-8288003-B2 | Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material | DIC CORPORATION (JP) | 2012-10-16 | — | — | US | disclosed |
| US-8263714-B2 | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-8263714-B2 | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20120095156-A1 | METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL | DIC CORPORATION (JP) | 2012-04-19 | — | — | US | disclosed |
| US-20110275739-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-11-10 | — | — | US | disclosed |
| US-20110275739-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-11-10 | — | — | US | disclosed |
| US-7985822-B2 | Epoxy resin cured with phenol-formaldehyde resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-07-26 | — | — | US | disclosed |
| US-20100087590-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20090054585-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120095156-A1 | METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL | PPA1, RBBP4, SMARCB1 | DHFR 3648/4885NPC1 4638/4885POLB 151/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.