SCHEMBL26105231

SCHEMBL26105231

O=C1C=CC(=O)N1c1c(N2C(=O)C=CC2=O)c(N2C(=O)C=CC2=O)c2ccccc2c1N1C(=O)C=CC1=O

nearest known ligand 0.54

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ TLR9 Q9NR96 1/20 0.54
▸ MGLL Q99685 16/20 0.52
▸ FAAH O00519 5/20 0.46
▸ HSP90AA1 P07900 4/20 0.42
▸ ALDH1A1 P00352 2/20 0.41
▸ HTT P42858 2/20 0.41
▸ ATM Q13315 2/20 0.41
▸ HPGD P15428 1/20 0.41
▸ XBP1 P17861 1/20 0.41
▸ ALOX12 P18054 1/20 0.41
▸ RUNX1 Q01196 1/20 0.41
▸ CBFB Q13951 1/20 0.41
▸ PKM P14618 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19511809 0.95 TLR9 (0.54) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883483 0.78 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883464 0.78 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL722543 0.76 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL29378993 0.76 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL31180023 0.75 TLR9 (0.68) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL5077484 0.75 TLR9 (0.68) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883572 0.73 MGLL (0.44) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883417 0.73 MGLL (0.44) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL21826723 0.73 TLR9 (0.52) TLR9MGLLFAAHHSP90AA1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023187625-A1 ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE 藤森工業株式会社 2023-10-05 — — WO disclosed
WO-2023187624-A1 ADHESIVE-EQUIPPED METAL SUBSTRATE AND LAMINATE 藤森工業株式会社 2023-10-05 — — WO disclosed
CN-111164127-A Curable resin composition, varnish, prepreg, cured product, and laminate or copper-clad laminate 日本化药株式会社 2020-05-15 — — CN disclosed
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