SCHEMBL19511809

SCHEMBL19511809

O=C1C=CC(=O)N1c1c(N2C(=O)C=CC2=O)c2ccccc2c2ccccc12

nearest known ligand 0.54

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ TLR9 Q9NR96 1/20 0.54
▸ MGLL Q99685 16/20 0.52
▸ FAAH O00519 5/20 0.46
▸ HSP90AA1 P07900 4/20 0.42
▸ ALDH1A1 P00352 2/20 0.41
▸ HTT P42858 2/20 0.41
▸ ATM Q13315 2/20 0.41
▸ HPGD P15428 1/20 0.41
▸ XBP1 P17861 1/20 0.41
▸ ALOX12 P18054 1/20 0.41
▸ RUNX1 Q01196 1/20 0.41
▸ CBFB Q13951 1/20 0.41
▸ PKM P14618 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26105231 0.95 TLR9 (0.54) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883483 0.78 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL28883464 0.78 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL29378993 0.76 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL722543 0.76 MGLL (0.48) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL31180023 0.75 TLR9 (0.68) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL5077484 0.75 TLR9 (0.68) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL31179986 0.73 TLR9 (0.52) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL21826723 0.73 TLR9 (0.52) TLR9MGLLFAAHHSP90AA1ALDH1A1
SCHEMBL397529 0.72 TSHR (0.52) TLR9MGLLHSP90AA1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220112373-A1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2022-04-14 — — US disclosed
CN-109689742-B Curable resin mixture and method for producing curable resin composition 昭和电工株式会社 2021-12-10 — — CN disclosed
US-20210284783-A1 METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2021-09-16 — — US disclosed
CN-113316597-A Thermosetting resin composition 昭和电工株式会社 2021-08-27 — — CN disclosed
US-10689493-B2 Thermosetting resin composition SHOWA DENKO K.K. (JP) 2020-06-23 — — US disclosed
EP-3613780-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 — — EP disclosed
EP-3613781-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 — — EP disclosed
US-20200031966-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 — — US disclosed
US-20200031973-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 — — US disclosed
EP-3239199-B1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO KK (JP) 2019-09-25 — — EP disclosed
EP-3511363-A1 CURABLE RESIN MIXTURE AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION Showa Denko K.K. (JP) 2019-07-17 — — EP disclosed
CN-107108821-B Thermosetting resin composition 昭和电工株式会社 2019-07-16 — — CN disclosed
CN-109689742-A The manufacturing method of curable resin mixture and hardening resin composition 昭和电工株式会社 2019-04-26 — — CN disclosed
US-10160856-B2 Thermosetting resin composition SHOWA DENKO K.K. (JP) 2018-12-25 — — US disclosed
US-20180282494-A1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2018-10-04 — — US disclosed
US-20170349743-A1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2017-12-07 — — US disclosed
EP-3239199-A1 THERMOSETTING RESIN COMPOSITION Showa Denko K.K. (JP) 2017-11-01 — — EP disclosed
EP-3239200-A1 THERMOSETTING RESIN COMPOSITION Showa Denko K.K. (JP) 2017-11-01 — — EP disclosed
CN-107108821-A Thermosetting resin composition 昭和电工株式会社 2017-08-29 — — CN disclosed
CN-107001547-A Thermosetting resin composition 昭和电工株式会社 2017-08-01 — — CN disclosed
Send feedback