SCHEMBL262473

SCHEMBL262473

O=C1NC(=O)c2c(Oc3cccc4c3C(=O)NC4=O)cccc21

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GSK3B P49841 3/20 0.50
PARP1 P09874 5/20 0.47
KDM4E B2RXH2 1/20 0.46
ALDH1A1 P00352 1/20 0.46
GAA P10253 1/20 0.46
HPGD P15428 1/20 0.46
HSD17B10 Q99714 1/20 0.46
CASP3 P42574 5/20 0.43
CASP7 P55210 2/20 0.43
CASP2 P42575 1/20 0.43
CASP6 P55212 1/20 0.43
CASP8 Q14790 1/20 0.43
STK10 O94804 3/20 0.39
SLK Q9H2G2 3/20 0.39
CLK2 P49760 1/20 0.39
GSK3A P49840 1/20 0.39
STK33 Q9BYT3 1/20 0.39
CLK4 Q9HAZ1 1/20 0.39
TLK1 Q9UKI8 1/20 0.39
MEN1 O00255 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28099802 0.88 GSK3B (0.50) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL5506330 0.87 MAOA (0.51) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL27553346 0.87 KDM4E (0.41) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL384815 0.84 TOP1 (0.55) GSK3BKDM4EALDH1A1GAAHPGD
SCHEMBL9768590 0.84 KDM4E (0.51) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL29378366 0.84 TOP1 (0.55) GSK3BKDM4EALDH1A1GAAHPGD
SCHEMBL16628857 0.83 MAOA (0.41) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL28812042 0.83 MAOA (0.59) GSK3BHPGDGSK3AMEN1USP2
SCHEMBL9123193 0.81 GSK3B (0.43) GSK3BPARP1KDM4EALDH1A1GAA
SCHEMBL9787456 0.81 CXCL8 (0.54) KDM4EALDH1A1GAAHPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10815390-B2 Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof KANEKA CORPORATION (JP) 2020-10-27 US claimed
US-20180273798-A1 POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF KANEKA CORPORATION (JP) 2018-09-27 US claimed
US-10017666-B2 Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof KANEKA CORPORATION (JP) 2018-07-10 US claimed
EP-2995649-B1 POLYIMIDE RESIN COMPOSITION COMPRISING TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND AROMATIC THERMOPLASTIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, VARNISH, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL PROPERTIES, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL CONTAINING SAID PREPREG KANEKA CORP (JP) 2017-11-08 EP claimed
US-20160083618-A1 POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF KANEKA CORPORATION (JP) 2016-03-24 US claimed
EP-2995649-A1 POLYIMIDE RESIN COMPOSITION COMPRISING TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND AROMATIC THERMOPLASTIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, VARNISH, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL PROPERTIES, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL CONTAINING SAID PREPREG Kaneka Corporation (JP) 2016-03-16 EP claimed
EP-2097375-B1 METHOD FOR PURIFYING BISIMIDES SABIC INNOVATIVE PLASTICS IP (NL) 2013-04-24 EP claimed
EP-2097375-A1 METHOD FOR PURIFYING BISIMIDES Sabic Innovative Plastics IP B.V. (NL) 2009-09-09 EP claimed
US-7408070-B2 Method for purifying bisimides SABIC INNOVATIVE PLASTICS IP B.V. (US) 2008-08-05 US claimed
WO-2008063208-A1 METHOD FOR PURIFYING BISIMIDES SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-05-29 WO claimed
US-20070073063-A1 Method for purifying bisimides GENERAL ELECTRIC COMPANY (US) 2007-03-29 US claimed
US-5212261-A LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1993-05-18 US claimed
WO-1992011307-A1 LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1992-07-09 WO claimed
EP-0250981-B1 METHOD FOR MAKING BISIMIDES GENERAL ELECTRIC COMPANY (US) 1992-03-11 EP claimed
US-4933469-A Method for preparing oxybisphthalimides GENERAL ELECTRIC COMPANY (US) 1990-06-12 US claimed
US-4780544-A HEATING N-ORGANONITROPHTHALIMIDE IN PRESENCE OF APROTIC SOLVENT IN ALKALI METAL CARBOXYLATE GENERAL ELECTRIC COMPANY (US) 1988-10-25 US claimed
CN-115175951-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2022-10-11 CN disclosed
US-10815390-B2 Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof KANEKA CORPORATION (JP) 2020-10-27 US disclosed
EP-0264624-A1 Process for the preparation of oxy-diphthalic anhydrides OCCIDENTAL CHEMICAL CORPORATION (US) 1988-04-27 EP disclosed
US-4697023-A HYDROXYLATION OF HALOPHTHALIC ANHYDRIDE, ETHERIFICATION OCCIDENTAL CHEMICAL CORPORATION (US) 1987-09-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070073063-A1 Method for purifying bisimides FHIT, PBRM1, TNS4 GSK3B 4609/4885PARP1 1119/4885KDM4E 98/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.