SCHEMBL2629344

SCHEMBL2629344

CCC(C)(CC)CC(O)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12043851 0.79 NR1H2 (0.30)
SCHEMBL9979403 0.77 ALDH1A1 (0.30)
SCHEMBL11990044 0.75 AR (0.32)
SCHEMBL15134123 0.75 ALDH1A1 (0.37)
SCHEMBL85653 0.74 NR1H2 (0.36)
SCHEMBL24463793 0.73 CES2 (0.41)
SCHEMBL13917505 0.73
SCHEMBL20642225 0.72 TSHR (0.32)
SCHEMBL22623957 0.72 TSHR (0.32)
SCHEMBL22623997 0.72 CES2 (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130009323-A1 INTERCONNECT STRUCTURE AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-01-10 US disclosed
US-8334203-B2 Interconnect structure and method of fabricating INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-12-18 US disclosed
US-20120301980-A1 METHODOLOGY FOR EVALUATION OF ELECTRICAL CHARACTERISTICS OF CARBON NANOTUBES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-11-29 US disclosed
US-20120231622-A1 SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K MATERIAL AND METHODS OF FORMING SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-09-13 US disclosed
US-20120161296-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-28 US disclosed
US-8202783-B2 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-19 US disclosed
US-8163658-B2 Multiple patterning using improved patternable low-k dielectric materials INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-04-24 US disclosed
US-20110309507-A1 METHODOLOGY FOR EVALUATION OF ELECTRICAL CHARACTERISTICS OF CARBON NANOTUBES INTERNATIONAL BUSINESS MACHINES CORP. (US) 2011-12-22 US disclosed
US-20110304053-A1 INTERCONNECT STRUCTURE AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORP. (US) 2011-12-15 US disclosed
US-7919225-B2 Photopatternable dielectric materials for BEOL applications and methods for use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-04-05 US disclosed
US-20110074044-A1 PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-03-31 US disclosed
US-20110042790-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-02-24 US disclosed
US-20100314767-A1 SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K MATERIAL AND METHODS OF FORMING SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-12-16 US disclosed
US-20090291389-A1 PHOTOPATTERNABLE DIELECTRIC MATERIALS FOR BEOL APPLICATIONS AND METHODS FOR USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-11-26 US disclosed