SCHEMBL9979403

SCHEMBL9979403

CCC(C)(CC)CCC(O)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5844557 0.78
SCHEMBL2629344 0.77
SCHEMBL904330 0.73 FDPS (0.36) ALDH1A1
SCHEMBL85653 0.72 NR1H2 (0.36) ALDH1A1
SCHEMBL22623957 0.70 TSHR (0.32)
SCHEMBL27130734 0.70
SCHEMBL24121022 0.69 TSHR (0.30)
SCHEMBL2616357 0.69 CES1 (0.39)
SCHEMBL12043851 0.67 NR1H2 (0.30)
SCHEMBL2345427 0.67 CES2 (0.45)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130009323-A1 INTERCONNECT STRUCTURE AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-01-10 US disclosed
US-8334203-B2 Interconnect structure and method of fabricating INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-12-18 US disclosed
US-20120231622-A1 SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K MATERIAL AND METHODS OF FORMING SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-09-13 US disclosed
US-20120161296-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-28 US disclosed
US-8202783-B2 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-19 US disclosed
US-20110074044-A1 PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-03-31 US disclosed
US-7867689-B2 Method of use for photopatternable dielectric materials for BEOL applications INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-01-11 US disclosed
US-20100319971-A1 AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH IMPROVED PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-12-23 US disclosed
US-20100314767-A1 SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K MATERIAL AND METHODS OF FORMING SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-12-16 US disclosed
US-20080286467-A1 METHOD OF USE FOR PHOTOPATTERNABLE DIELECTRIC MATERIALS FOR BEOL APPLICATIONS GLOBALFOUNDRIES U.S. INC. 2008-11-20 US disclosed