SCHEMBL2629474

SCHEMBL2629474

CCC(C)(C)C(C)c1ccc(O)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 13/20 0.48
LMNA P02545 1/20 0.48
CYP1A2 P05177 1/20 0.48
PGR P06401 1/20 0.48
CHRM2 P08172 1/20 0.48
CYP3A4 P08684 1/20 0.48
ADORA3 P0DMS8 1/20 0.48
AR P10275 1/20 0.48
CYP2D6 P10635 1/20 0.48
MAPT P10636 1/20 0.48
CHRM1 P11229 1/20 0.48
CYP2C9 P11712 1/20 0.48
ALOX15 P16050 1/20 0.48
DRD1 P21728 1/20 0.48
TBXA2R P21731 1/20 0.48
PTGS1 P23219 1/20 0.48
SLC6A2 P23975 1/20 0.48
CYP2C19 P33261 1/20 0.48
ADRA1A P35348 1/20 0.48
OPRM1 P35372 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2629346 0.83 ESR1 (0.48) ESR1LMNACYP1A2PGRCHRM2
SCHEMBL19084288 0.82 CYP2C9 (0.52) ESR1LMNACYP1A2PGRCHRM2
SCHEMBL10339282 0.81 ESR1 (0.50) ESR1LMNACYP1A2PGRCHRM2
SCHEMBL10245468 0.79 AOC3 (0.35) LMNA
SCHEMBL22022476 0.79 ALDH1A1 (0.41) CYP1A2CYP3A4CYP2D6CYP2C9ALOX15
SCHEMBL14014347 0.79 ESR1 (0.48) ESR1LMNACYP1A2PGRCHRM2
SCHEMBL19231609 0.79 ADRB2 (0.45) LMNAMAPTSLC6A2SLC6A3TDP1
SCHEMBL19153487 0.79 TDP1 (0.46) LMNACYP1A2CYP3A4ADORA3CYP2D6
SCHEMBL68538 0.78 RIPK1 (0.45) LMNACHRM2CHRM1ADRA1ASLC6A3
SCHEMBL8751432 0.78 ESR1 (0.56) ESR1LMNACYP1A2PGRCHRM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022043236-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME MERCK PATENT GMBH (DE) 2022-03-03 WO disclosed
US-20120161296-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-28 US disclosed
US-8187789-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-05-29 US disclosed
US-8163658-B2 Multiple patterning using improved patternable low-k dielectric materials INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-04-24 US disclosed
US-8062750-B2 Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board MATSUSHITA ELECTRIC WORKS, LTD. (JP) 2011-11-22 US disclosed
US-20110042790-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-02-24 US disclosed
US-20090269700-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-10-29 US disclosed