Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SERPINE1 | P05121 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | FAAH | O00519 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26327631 | 0.83 | SERPINE1 (0.30) | SERPINE1 | |
| SCHEMBL19803182 | 0.83 | SERPINE1 (0.32) | SERPINE1HTT | |
| SCHEMBL13686650 | 0.82 | PRKCA (0.39) | SERPINE1LMNAHSD17B10 | |
| SCHEMBL13301441 | 0.80 | CYP4F2 (0.37) | SERPINE1LMNAHSD17B10 | |
| SCHEMBL18293615 | 0.79 | HTT (0.34) | LMNAHSD17B10HTT | |
| SCHEMBL20747687 | 0.78 | LMNA (0.35) | SERPINE1LMNAHSD17B10 | |
| SCHEMBL13857979 | 0.77 | CYP4F2 (0.39) | SERPINE1LMNAHSD17B10 | |
| SCHEMBL14991075 | 0.77 | ALDH1A1 (0.46) | SERPINE1LMNAHSD17B10 | |
| SCHEMBL26327650 | 0.75 | HTT (0.33) | SERPINE1HTT | |
| SCHEMBL23808379 | 0.75 | TSHR (0.40) | SERPINE1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |