SCHEMBL26327650

SCHEMBL26327650

CCC(C)(C)COC(=O)CC(F)(F)F

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.33
SERPINE1 P05121 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18963264 0.90 HTT (0.37) HTTSERPINE1
SCHEMBL25472464 0.86 ALDH1A1 (0.35) HTTSERPINE1
SCHEMBL26703700 0.79 SERPINE1 (0.32) SERPINE1
SCHEMBL6789266 0.79 NAAA (0.40) HTTSERPINE1
SCHEMBL974754 0.78 HTT (0.52) HTT
SCHEMBL23235063 0.77
SCHEMBL17734166 0.77 CYP4F2 (0.33)
SCHEMBL974467 0.76 GAA (0.52)
SCHEMBL6785073 0.75 SERPINE1 (0.32) SERPINE1
SCHEMBL26327638 0.75 SERPINE1 (0.32) HTTSERPINE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed